公开(公告)号：US20180294245A1

公开(公告)日：2018-10-11

申请号：US15853170

申请日：2017-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGSIK KIM ,  DOOJIN KIM ,  SEOKHO LEE ,  YOUNGGON HWANG

IPC: H01L23/00 ,  B23K3/02

Abstract: A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

公开(公告)号：US20170040202A1

公开(公告)日：2017-02-09

申请号：US15215578

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： DOOJIN KIM ,  YOUNGSIK KIM ,  KUNHO SONG ,  YONGDAE HA

IPC: H01L21/683 ,  B24B37/34 ,  B24B37/30 ,  H01L21/67 ,  B24B37/10

CPC classification number: H01L21/6838 ,  B24B27/0061 ,  B24B37/10 ,  B24B37/30 ,  B24B37/345 ,  B25B11/005 ,  H01L21/68785

Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.

Abstract translation: 提供了一个卡盘台和一个包括该卡盘台的基板处理系统。 夹盘包括具有第一真空孔的基盘和设置在第一真空孔上的卡盘盘。 夹盘包括多个第一扇区和将第一扇区彼此连接的第一连接构件。