公开(公告)号：US20240203942A1

公开(公告)日：2024-06-20

申请号：US18354928

申请日：2023-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Jang ,  Eunsu Lee ,  Daeyoung Jung

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/10

CPC classification number: H01L25/0655 ,  H01L23/481 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/48229 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, and a width of each of the second semiconductor chips is smaller than a width of the first semiconductor chip.

公开(公告)号：US20240395760A1

公开(公告)日：2024-11-28

申请号：US18509930

申请日：2023-11-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeyoung Jung

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H10B80/00

Abstract: Disclosed is a semiconductor package comprising a substrate that includes bonding pads on an upper edge of the substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip, a plurality of bonding wires configured to connect the second semiconductor chip to the bonding pads, a plurality of dam structures on the substrate and between the first semiconductor chip and the bonding pads, and a molding member on the plurality of dam structures, the substrate, the first semiconductor chip, and the second semiconductor chip. The plurality of dam structures includes a first dam structure having a closed loop shape that extends around the first semiconductor chip, and a second dam structure between the first dam structure and the bonding pads.