公开(公告)号：US20230139141A1

公开(公告)日：2023-05-04

申请号：US18050705

申请日：2022-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Jang ,  Eunsu Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/10

Abstract: A semiconductor package includes a first package substrate, a semiconductor chip on the first package substrate, a second package substrate over the first package substrate and the semiconductor chip, and a plurality of core structures and a plurality of solder balls. The core structures and the solder balls are between the first package substrate and the second package substrate, a first portion of the plurality of core structures and the plurality of solder balls are apart from the semiconductor chip in a first dimension direction, and a second portion of the plurality of core structures and the plurality of solder balls are apart from the semiconductor chip in a second dimension direction that is different than the first dimension direction. The semiconductor package includes a plurality of strip guides between the semiconductor chip and the plurality of core structures, and in parallel with a periphery of the semiconductor chip.

公开(公告)号：US20240203942A1

公开(公告)日：2024-06-20

申请号：US18354928

申请日：2023-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Jang ,  Eunsu Lee ,  Daeyoung Jung

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/10

CPC classification number: H01L25/0655 ,  H01L23/481 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/48229 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, and a width of each of the second semiconductor chips is smaller than a width of the first semiconductor chip.

公开(公告)号：US09497434B2

公开(公告)日：2016-11-15

申请号：US13892490

申请日：2013-05-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Jang

IPC: H04N5/93 ,  H04N9/79 ,  H04N21/432 ,  H04N21/44 ,  H04N21/431 ,  H04N21/482 ,  H04N21/8549

CPC classification number: H04N9/79 ,  H04N21/431 ,  H04N21/4312 ,  H04N21/4325 ,  H04N21/44 ,  H04N21/44004 ,  H04N21/482 ,  H04N21/8549

Abstract: A method of multi-playing videos in an apparatus having a first decoder for decoding a video and a controller for controlling the decoder includes determining, by the controller, whether the first decoder is in use, generating video clips by decoding a video by the controller as a second decoder if the first decoder is in use, storing video clips in a storage unit, and simultaneously playing video clips stored in the storage unit in response to detection of a preview request event.

Abstract translation: 一种在具有用于解码视频的第一解码器和用于控制解码器的控制器的设备中的多播放视频的方法包括：由控制器确定第一解码器是否在使用中，通过由控制器解码视频产生视频片段 作为第二解码器，如果第一解码器正在使用，则将视频剪辑存储在存储单元中，并且响应于预览请求事件的检测，同时播放存储在存储单元中的视频剪辑。