Abstract:
A semiconductor device includes a substrate including an active region, a gate trench disposed in the substrate and crossing the active region; a gate dielectric layer disposed in the gate trench; a first gate electrode disposed on the gate dielectric layer and including center and edge portions; a second gate electrode disposed on the first gate electrode; a gate capping insulating layer disposed on the second gate electrode and filling the gate trench; and first and second impurity regions disposed in the substrate opposite to each other with respect to the gate trench. A top surface of each of the center and edge portions contacts a bottom surface of the second gate electrode. The top surface of the second gate electrode is concave. The bottom surface of the gate capping insulating layer is convex, and a side surface of the gate capping insulating layer contacts the gate dielectric layer.
Abstract:
A semiconductor device and a method of forming the same are provided. The semiconductor device includes a gate trench crossing an active region, and a gate structure in the gate trench. The gate structure includes a gate dielectric layer disposed on an inner wall of the gate trench, a gate electrode disposed on the gate electric layer and partially filling the gate trench, a gate capping insulating layer disposed on the gate electrode, and a gap-fill insulating layer disposed in the gate trench and disposed on the gate capping insulating layer. The gate capping insulating layer includes a material formed by oxidizing a portion of the gate electrode, nitriding the portion of the gate electrode, or oxidizing and nitriding the portion of the gate electrode.
Abstract:
Methods of forming a semiconductor device are provided. The methods may include forming an insulating layer including silicon on a substrate and sequentially forming a first hard mask layer and a second hard mask layer on the substrate. The first hard mask layer may include carbon, and the second hard mask layer may include carbon and impurities. The first and second hard mask layers may expose at least a portion of the insulating layer. The methods may also include performing an etching process to selectively remove the second hard mask layer with respect to the insulating layer. A ratio of etch rates between the second hard mask layer and the insulating layer during the etching process may be in a range of about 100:1 to about 10,000:1.
Abstract:
A method of fabricating a semiconductor device with capacitors may include forming a mold structure on a lower structure, patterning the mold structure to form a plurality of holes exposing the lower structure, forming a protection layer on sidewalls of the mold structure exposed by the holes, forming lower electrodes in the holes provided with the protection layer, removing the mold structure to expose the protection layer, removing the protection layer to expose sidewalls of the lower electrodes, and sequentially forming a dielectric film and an upper electrode on the lower electrodes.
Abstract:
Provided is a method, performed by a server, of providing a personalized spatial map, the method comprising: obtaining a first spatial map including first map features representing spatial information about a space; obtaining a second spatial map based on sensor data obtained by measuring the space, the second spatial map including second map features; identifying third map features for map alignment from among the first map features and the second map features; aligning the first spatial map and the second spatial map, based on the identified third map features; identifying local areas in the space where at least one difference exists between the first spatial map and the second spatial map; and generating the personalized spatial map by identifying pieces of spatial information about the local areas based on the second map features.
Abstract:
A method includes: obtaining a first image of an object including a surface having a non-flat shape; identifying a region corresponding to the surface as a region of interest by applying the first image to a first artificial intelligence model; obtaining data about a three-dimensional (3D) shape type of the object by applying the first image to a second AI model; obtaining a set of values of a 3D parameter related to the object, the surface, or the first camera, based on the region and the data; estimating the non-flat shape of the surface, based on the set of values of the 3D parameter; and obtaining a flat surface image in which the non-flat shape of the surface is flattened, by performing a perspective transformation on the surface.
Abstract:
An image sensor and a method of fabricating the image sensor, the image sensor including a semiconductor substrate having a first floating diffusion region, a molding pattern over the first floating diffusion region and including an opening, a first photoelectric conversion part at a surface of the semiconductor substrate, and a first transfer transistor connecting the first photoelectric conversion part to the first floating diffusion region. The first transfer transistor includes a channel pattern in the opening and a first transfer gate electrode. The channel pattern includes an oxide semiconductor. The channel pattern also includes a sidewall portion that covers a side surface of the opening, and a center portion that extends from the sidewall portion to a region over the first transfer gate electrode.
Abstract:
An electronic device and a controlling method of the electronic device are provided. The controlling method of an electronic device according to the disclosure includes the steps of, based on a first user input for or related to acquiring a live view image through a camera including a plurality of lenses different from one another being received, acquiring a plurality of image frames for each of the plurality of lenses and storing the image frames in a first memory, inputting the plurality of image frames for each lens stored in the first memory into a neural network model, by a predetermined time interval, and acquiring score information including composition preference information of each of the input image frames, selecting at least one lens among the plurality of lenses based on the score information, storing image frames acquired through the selected at least one lens in a second memory during the predetermined time interval, and based on a second user input for initiating recording of the live view image being received, storing an image related to the image frames stored in the second memory in a third memory until a time point when a third user input for ending the recording is received.
Abstract:
Disclosed are three-dimensional semiconductor memory devices and methods of detecting electrical failure thereof. The three-dimensional semiconductor memory device includes a substrate with a first conductivity including a cell array region and an extension region having different threshold voltages from each other, a stack structure on the substrate and including stacked electrodes, an electrical vertical channel penetrating the stack structure on the cell array region, and a dummy vertical channel penetrating the stack structure on the extension region. The substrate comprises a pocket well having the first conductivity and provided with the stack structure thereon, and a deep well surrounding the pocket well and having a second conductivity opposite to the first conductivity.
Abstract:
A method of fabricating a semiconductor device is disclosed. The method may include forming an target layer on a substrate, forming a mask pattern on a target layer, performing a first process to etch the target layer and form a first sub-trench, and performing a second process to further etch the target layer and form a second sub-trench. First and second sidewall patterns may be formed on a sidewall of the mask pattern to be used as an etch mask in the first and second processes, respectively. Outer sidewalls of the first and second sidewall patterns may be formed to have different angles with respect to a top surface of the substrate.