公开(公告)号：US20230199097A1

公开(公告)日：2023-06-22

申请号：US18110451

申请日：2023-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Juhee HAN

IPC: H04M1/02 ,  G06F1/20

CPC classification number: H04M1/0268 ,  H04M1/0216 ,  G06F1/203

Abstract: According to various embodiments of the present disclosure, an electronic device may include a first housing, a second housing connected to the first housing via a hinge structure, an electronic component, a flexible display being configured to be foldable according to rotation, a heat dissipation sheet arranged under the flexible display, and a first adhesive layer configured to bond the flexible display and the heat dissipation sheet to each other. The heat dissipation sheet may include a first portion corresponding to the first housing, a second portion corresponding to the second housing, and a third portion interconnecting the first portion and the second portion and corresponding to the hinge structure. The third portion may include a structure that protrudes or is folded at least once with respect to the first portion and the second portion. The first adhesive layer may include a first opening corresponding to the third portion.

公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungbok LEE ,  Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Jieun HWANG ,  Myungjun KIM ,  Min PARK ,  Sunga YANG

IPC: H01L23/552 ,  H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H05K7/20445 ,  H05K9/0032

Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.

公开(公告)号：US20220322516A1

公开(公告)日：2022-10-06

申请号：US17713438

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongyoun KIM ,  Chanhee OH ,  Dongkee JUNG

IPC: H05K1/02 ,  H01Q9/04 ,  H01Q5/25 ,  H01Q1/02

Abstract: According to various embodiments of the disclosure, an electronic device may include a housing, a non-conductive supporting member disposed in the housing and including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area, a conductive pattern portion disposed over the first area of the supporting member, a heat dissipation member disposed to at least partially overlap the conductive pattern portion, and an antenna including a circuit board, a conductive portion, and a ground portion. The conductive portion of the antenna may be disposed over the second area. The heat dissipation member may extend from the first area to the third area, and the ground portion of the antenna may extend from the second area to the third area to contact at least a portion of the heat dissipation member.