SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250159871A1

    公开(公告)日:2025-05-15

    申请号:US18664850

    申请日:2024-05-15

    Abstract: A semiconductor memory device may include a substrate including a cell region, a peripheral region, and a boundary region therebetween, a plurality of gate electrodes extending in a first direction within the substrate of the cell region, a plurality of bit lines extending in a second direction crossing the first direction on the substrate of the cell region and the boundary region, a plurality of buried contacts connected to the substrate of the cell region and between the gate electrodes and between the bit lines on the substrate of the cell region, a dummy buried contact between the bit lines on the substrate of the boundary region, and a bit line contact connected to at least one of the bit lines on the substrate of the boundary region, wherein the dummy buried contact includes an insulating material.

    SEMICONDUCTOR MEMORY DEVICE
    2.
    发明公开

    公开(公告)号:US20240064968A1

    公开(公告)日:2024-02-22

    申请号:US18321511

    申请日:2023-05-22

    CPC classification number: H10B12/482 H10B12/315 H10B12/34 H10B12/485 H10B12/02

    Abstract: Provided is a semiconductor memory device comprising an active region extending in a cell isolation layer, wherein the active region includes a first region and a second region; a bit line intersects the active region; a bit line contact between a substrate and the bit line, wherein the bit line contact is electrically connected to the first region; a bit line spacer that is on side surfaces of the bit line and the bit line contact; a node pad on a lateral side of the bit line spacer, wherein the node pad is electrically connected to the second region; a storage contact that is on the node pad and on a side surface of the bit line spacer, wherein the storage contact includes a first part having a first width and a second part having a second width different from the first width.

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