公开(公告)号：US11800688B2

公开(公告)日：2023-10-24

申请号：US17289285

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haein Chung ,  Kyungha Koo ,  Seungjae Bae ,  Hyunjoong Yoon ,  Jaeho Chung ,  Yongwon Cho

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20509 ,  G06F1/203 ,  H05K7/20336

Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

公开(公告)号：US11978276B2

公开(公告)日：2024-05-07

申请号：US17985596

申请日：2022-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhee Han ,  Hanul Moon ,  Soohwan Kim ,  Seungjae Bae ,  Inho Shin ,  Jiyoung Lim ,  Yongwon Cho ,  Jiwoo Lee

IPC: G06K9/00 ,  G06F1/16 ,  G06V40/13

CPC classification number: G06V40/13 ,  G06F1/1633

Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.

公开(公告)号：US10819836B2

公开(公告)日：2020-10-27

申请号：US16387059

申请日：2019-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinho Lim ,  Seungjae Bae ,  Yonghwa Kim ,  Jinyoung Park ,  Bokyung Sim ,  Byounguk Yoon

IPC: H04R1/02 ,  H04M1/03 ,  H04R1/32

Abstract: A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.

公开(公告)号：US10594847B2

公开(公告)日：2020-03-17

申请号：US16482401

申请日：2018-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseok Lee ,  Minsu Jung ,  Seungjae Bae ,  Jongkyun Im ,  Jina Mock ,  Jinyoung Park

IPC: H04M1/02

Abstract: Disclosed is an electronic device comprising: a housing including a first plate, a second plate and a lateral member for covering a gap between the first plate and the second plate; a touch screen display exposed through a first part of the first plate; a sensor exposed through the first plate; a wireless communication circuit arranged inside the housing; and a processor which is arranged inside the housing and is electrically connected to the touch screen display, the sensor and the wireless communication circuit. In addition, other embodiments are possible.

公开(公告)号：US10205807B2

公开(公告)日：2019-02-12

申请号：US15351055

申请日：2016-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjae Bae ,  Taedoo Choung

IPC: G06F1/16 ,  H05K7/00 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a first plate, a second plate having a flat surface and being at least partially formed of a polymer material, a housing, which encloses a space between the first plate and the second plate, is at least partially formed of a metal material, and includes a side member that is integrally formed with the second plate, wherein the side member has a first portion adjacent to a peripheral portion of the second plate, and the first portion has a first surface substantially facing in the second direction, contacts the peripheral portion of the second plate, and has a second surface facing in a third direction different from the first direction and the second direction.

公开(公告)号：US09800768B2

公开(公告)日：2017-10-24

申请号：US14837996

申请日：2015-08-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjae Bae ,  Soonwoong Yang ,  Seungki Choi

IPC: H04N5/225 ,  H04N5/232

CPC classification number: H04N5/2257 ,  H04N5/23258

Abstract: An electronic device having a camera module. The electronic device comprises: a Printed Circuit Board (PCB) located on a surface of the camera module; a lens module mounted on a first area of the PCB; fixing maintaining components mounted on a second area of the PCB; and a third area located between the first area and the second area, and having at least one opening.