公开(公告)号：US20200088827A1

公开(公告)日：2020-03-19

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R35/00 ,  G01R31/28 ,  G01R1/04 ,  G01R1/073

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

公开(公告)号：US11067658B2

公开(公告)日：2021-07-20

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R31/26 ,  G01R35/00 ,  G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.