公开(公告)号：US20200088827A1

公开(公告)日：2020-03-19

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R35/00 ,  G01R31/28 ,  G01R1/04 ,  G01R1/073

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

公开(公告)号：US09696402B2

公开(公告)日：2017-07-04

申请号：US14555538

申请日：2014-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shin-ho Kang ,  Joon-su Ji ,  Jung-woo Kim

IPC: G01R31/02 ,  G01R35/00 ,  G01R31/28

CPC classification number: G01R35/00 ,  G01R31/2889

Abstract: Provided is a probe card inspection apparatus including: a substrate; a first insulating layer which covers the substrate; and a first detection unit which is formed on the first insulating layer and detects physical defects of a probe of a probe card. The first detection unit includes: a ground detection unit including a first conductive pattern which defines a plurality of openings which expose a portion of the first insulating layer and detect defects of a ground probe of the probe card and; and a signal and power detection unit including a second conductive pattern which defines a plurality of openings which expose another portion of the first insulating layer and detect defects of a signal and power supply probe of the probe card.

公开(公告)号：US11067658B2

公开(公告)日：2021-07-20

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R31/26 ,  G01R35/00 ,  G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

公开(公告)号：US20150168528A1

公开(公告)日：2015-06-18

申请号：US14555538

申请日：2014-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shin-ho Kang ,  Joon-su Ji ,  Jung-woo Kim

IPC: G01R35/00 ,  G01R31/00

CPC classification number: G01R35/00 ,  G01R31/2889

Abstract: Provided is a probe card inspection apparatus including: a substrate; a first insulating layer which covers the substrate; and a first detection unit which is formed on the first insulating layer and detects physical defects of a probe of a probe card. The first detection unit includes: a ground detection unit including a first conductive pattern which defines a plurality of openings which expose a portion of the first insulating layer and detect defects of a ground probe of the probe card and; and a signal and power detection unit including a second conductive pattern which defines a plurality of openings which expose another portion of the first insulating layer and detect defects of a signal and power supply probe of the probe card.

Abstract translation: 提供一种探针卡检查装置，包括：基板; 覆盖基板的第一绝缘层; 以及第一检测单元，其形成在所述第一绝缘层上并且检测所述探针卡的探针的物理缺陷。 第一检测单元包括：接地检测单元，包括限定多个开口的第一导电图案，第一导电图案暴露第一绝缘层的一部分并检测探针卡的接地探针的缺陷; 以及信号和功率检测单元，其包括限定多个开口的第二导电图案，所述多个开口暴露所述第一绝缘层的另一部分并且检测所述探针卡的信号和电源探针的缺陷。