公开(公告)号：US09590662B2

公开(公告)日：2017-03-07

申请号：US14864160

申请日：2015-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu-Bok Park ,  Hee-Jun Lee ,  Cheol-Hong Son ,  Austin Kim ,  Joon-Ho Byun ,  Se-Hyun Park ,  Seong-Tae Jeong

IPC: H04B1/00 ,  H04B15/00 ,  H04B1/38 ,  H01Q1/24 ,  H01Q1/44 ,  H03K17/955 ,  H01Q9/42 ,  H04B1/3827 ,  H04W52/24 ,  H04W52/28 ,  H03K17/96 ,  H04W88/06

CPC classification number: H04B1/0053 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q9/42 ,  H03K17/955 ,  H03K2017/9606 ,  H03K2217/960755 ,  H04B1/3838 ,  H04B15/00 ,  H04W52/243 ,  H04W52/283 ,  H04W88/06

Abstract: An apparatus interworking with a metal member used both as an antenna and a sensor element in a portable terminal is disclosed. The apparatus includes the metal member, responsive to a sensed body, and for transmitting and receiving a signal in at least one or more communication service bands, and a main board having a communication module for processing a signal transmitted and received by the metal member and a sensor module for obtaining information in response to the approach of a sensed body.

Abstract translation: 公开了一种与便携式终端中用作天线和传感器元件的金属部件相互配合的装置。 该装置包括金属构件，响应于感测到的身体，并且用于在至少一个或多个通信服务频带中发送和接收信号;以及主板，具有用于处理由金属构件发送和接收的信号的通信模块，以及 传感器模块，用于响应感测身体的接近获得信息。

公开(公告)号：US12169678B2

公开(公告)日：2024-12-17

申请号：US17510652

申请日：2021-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Useong Kim ,  Bayram Yenikaya ,  Mindy Lee ,  Xin Zhou ,  Hee-Jun Lee ,  Woo-Yong Cho

IPC: G06F30/398 ,  G06V10/44 ,  G06V10/88

Abstract: Disclosed is an operating method of an electronic device for manufacture of a semiconductor device. The operating method includes receiving a layout image of the semiconductor device, generating an intermediate image by generating assist features based on main features of the layout image, evaluating a process result by performing simulation based on the intermediate image, and correcting the intermediate image by correcting shapes of the main features and/or the assist features of the intermediate image based on the process result.

公开(公告)号：US20250004361A1

公开(公告)日：2025-01-02

申请号：US18437779

申请日：2024-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Yong Cho ,  Hun Kang ,  Sangwook Kim ,  Useong Kim ,  Heungsuk Oh ,  Hee-Jun Lee ,  Jeeeun Jung

IPC: G03F1/36

Abstract: Disclosed are semiconductor fabrication methods and optical proximity correction (OPC) methods. The semiconductor fabrication method comprises performing OPC on a design pattern of a layout to generate a corrected layout, and forming a photoresist pattern on a substrate by using a photomask manufactured with the corrected layout. Performing the OPC includes generating shape points on a contour of the design pattern, producing a hash value of the shape point, selecting a first unique shape point that represents first shape points, determining a first correction bias of the first unique shape point, and creating a correction pattern by applying the first correction bias in common to the first shape points. Producing the hash value includes generating a query range around a target shape point and, based on geometry analysis in the query range, producing the hash value.