公开(公告)号：US20250022823A1

公开(公告)日：2025-01-16

申请号：US18904203

申请日：2024-10-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ju-Il CHOI ,  Pil-Kyu KANG ,  Hoechul KIM ,  Hoonjoo NA ,  Jaehyung PARK ,  Seongmin SON

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L27/146

Abstract: A semiconductor device and a semiconductor package, the device including a first buffer dielectric layer on a first dielectric layer; a second dielectric layer and a second buffer dielectric layer sequentially disposed on the first buffer dielectric layer, the second buffer dielectric layer being in contact with the first buffer dielectric layer; and a pad interconnection structure that penetrates the first buffer dielectric layer and the second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin.

公开(公告)号：US20220068852A1

公开(公告)日：2022-03-03

申请号：US17501133

申请日：2021-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-Il CHOI ,  Pil-Kyu KANG ,  Hoechul KIM ,  Hoonjoo NA ,  Jaehyung PARK ,  Seongmin SON

IPC: H01L23/00 ,  H01L25/16 ,  H01L27/146 ,  H01L23/31

Abstract: A semiconductor device and a semiconductor package, the device including a first buffer dielectric layer on a first dielectric layer; a second dielectric layer and a second buffer dielectric layer sequentially disposed on the first buffer dielectric layer, the second buffer dielectric layer being in contact with the first buffer dielectric layer; and a pad interconnection structure that penetrates the first buffer dielectric layer and the second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin.

公开(公告)号：US20200373274A1

公开(公告)日：2020-11-26

申请号：US16783342

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Taeyeong KIM ,  Jihoon KANG ,  Nohsung KWAK ,  Seokho KIM ,  Hoechul KIM ,  Ilhyoung LEE ,  Hakjun LEE

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.

公开(公告)号：US20240153906A1

公开(公告)日：2024-05-09

申请号：US18386687

申请日：2023-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongtak PARK ,  Gwanghee JO ,  Siwoong WOO ,  Jiwon SON ,  Yongjoo LEE ,  Hoechul KIM ,  Inhwa BAEK ,  Seungdae SEOK ,  Sehoon JANG ,  Jaehyun PHEE

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L2224/74 ,  H01L2924/40

Abstract: A substrate bonding apparatus includes a first bonding chuck having a first base, a deformable plate on the first base to support a first substrate, and a lower pressurer under the first base to apply pressure to the deformable plate, and a second bonding chuck vertically spaced apart from the first bonding chuck and having a second base to fix a second substrate, and an upper pressurer to apply pressure to the second substrate. The deformable plate includes an outer portion surrounding a center portion, a bottom surface of the outer portion of the deformable plate being adhered to the first base, the center portion being deformable in the vertical direction by the lower pressurer, and thicknesses of the center and outer portions of the deformable plate in the vertical direction being different from each other.

公开(公告)号：US20220020624A1

公开(公告)日：2022-01-20

申请号：US17218606

申请日：2021-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun PHEE ,  Hoechul KIM ,  Seokho KIM ,  Taeyeong KIM ,  Hoonjoo NA

IPC: H01L21/68 ,  H01L21/67

Abstract: A wafer bonding apparatus including a first stage having a first surface and being configured to hold a first wafer on the first surface; a second stage having a second surface and being configured to hold a second wafer on the second surface facing the first surface; a first target image sensor on an outer portion of the first stage; a second target image sensor on an outer portion of the second stage; and a target portion on the first or second stage, the target portion having a target plate fixedly installed and spaced apart from the first or second target image sensor by a predetermined distance, wherein, in an alignment measurement of the first and second stages, the first and second stages are movable so that the first and second target image sensors face each other and the target plate is between the first and second target image sensors.

公开(公告)号：US20200098711A1

公开(公告)日：2020-03-26

申请号：US16404841

申请日：2019-05-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-Il CHOI ,  Pil-Kyu KANG ,  Hoechul KIM ,  Hoonjoo NA ,  Jaehyung PARK ,  Seongmin SON

IPC: H01L23/00 ,  H01L25/16

Abstract: A semiconductor device and a semiconductor package, the device including a first buffer dielectric layer on a first dielectric layer; a second dielectric layer and a second buffer dielectric layer sequentially disposed on the first buffer dielectric layer, the second buffer dielectric layer being in contact with the first buffer dielectric layer; and a pad interconnection structure that penetrates the first buffer dielectric layer and the second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin.