METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

    公开(公告)号:US20240404931A1

    公开(公告)日:2024-12-05

    申请号:US18436993

    申请日:2024-02-08

    Abstract: A method includes: forming a first photoresist layer on a first insulating layer; forming a first photoresist pattern having first opening patterns using a first exposure mask; etching the first insulating layer using the first photoresist pattern to form first via holes; removing the first photoresist pattern; forming a second photoresist layer on the first insulating layer; forming a second photoresist pattern having second opening patterns using a second exposure mask; etching the first insulating layer using the second photoresist pattern to form second via holes; removing the first photoresist pattern; forming a redistribution wiring layer on the first insulating layer, the redistribution wiring layer having first redistribution wirings connected to first bonding pads under the first insulating layer through the via holes; and mounting a semiconductor chip on the redistribution wiring layer, the semiconductor chip comprising chip pads connected to the first redistribution wirings.

    INTEGRATED CIRCUIT INCLUDING MEMORY CELL AND METHOD OF DESIGNING THE SAME

    公开(公告)号:US20220037339A1

    公开(公告)日:2022-02-03

    申请号:US17371522

    申请日:2021-07-09

    Abstract: An integrated circuit includes: a first wiring layer on which a first bit line pattern and a positive power supply pattern, a first power supply line landing pad, and a first word line landing pad are formed; a second wiring layer on which a first negative power supply pattern connected to the first power supply line landing pad, and a first word line pattern connected to the first word line landing pad are formed; a third wiring layer on which a second negative power supply pattern connected to the first negative power supply pattern, and a second word line landing pad connected to the first word line pattern are formed; and a fourth wiring layer on which a second word line pattern, connected to the second word line landing pad, are formed.

    APPARATUS AND METHOD FOR MANAGING SCHEDULE IN ELECTRONIC DEVICE

    公开(公告)号:US20200258029A1

    公开(公告)日:2020-08-13

    申请号:US16790521

    申请日:2020-02-13

    Abstract: A method and apparatus for managing a schedule. According to various embodiments, an electronic device includes a display, and at least one processor configured to be connected to the display. The processor is configured to: acquire schedule information associated with operation of the device from a user, generate at least one first schedule based on the schedule information, identify at least one second schedule stored in a calendar application, identify a section in which time information of the first schedule and time information of the second schedule at least partially overlap each other by comparing the time information of the first schedule with the time information of the second schedule, and output an option capable of changing the operation of the device related to the first schedule based on the overlapping section between the first schedule and the second schedule. Various embodiments are possible.

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