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公开(公告)号:US10790147B2
公开(公告)日:2020-09-29
申请号:US15960583
申请日:2018-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jang-Hee Lee , Se-Ran Oh , Hyun-Su Kim , Ik-Soo Kim , Seong-Gil Park , Geun-O Jeong
IPC: H01L21/033 , H01L21/3213 , H01L21/3205 , H01L21/3215
Abstract: A method of manufacturing a semiconductor device includes forming an etch target layer on a substrate; forming an amorphous metal layer on the etch target layer, the amorphous metal layer comprising nitrogen between 15 atomic percentage (at %) and 25 at %; forming an amorphous metal hardmask by patterning the amorphous metal layer; and etching the etch target layer by using the amorphous metal hardmask as an etching mask.
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公开(公告)号:US11114881B2
公开(公告)日:2021-09-07
申请号:US16436574
申请日:2019-06-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-Jin Jeong , Hyun-Su Kim
Abstract: A load switch circuit includes a charging transistor, a current sensor, a voltage sensor, a selector, a current controller and a mode controller. The charging transistor is connected between a first switch node and a second switch node and controls a charging current in response to a charging control signal. The current sensor is connected to the first switch node and the second switch node and senses the charging current to generate a current sensing signal. The voltage sensor is connected to the first switch node and the second switch node and senses a source-drain voltage of the charging transistor to generate a voltage sensing signal. The selector selects the current sensing signal or the voltage sensing signal in response to a mode signal to generate a selection voltage signal. The current controller compares the selection voltage signal with a reference voltage to generate the charging control signal.
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