ULTRASOUND APPARATUS AND CONTROL METHOD THEREOF
    1.
    发明申请
    ULTRASOUND APPARATUS AND CONTROL METHOD THEREOF 审中-公开
    超声波设备及其控制方法

    公开(公告)号:US20140221837A1

    公开(公告)日:2014-08-07

    申请号:US14169604

    申请日:2014-01-31

    CPC classification number: A61B8/0858 A61B8/085 A61M5/46

    Abstract: Disclosed are an ultrasound apparatus and a control method thereof, in which the thickness of subcutaneous tissue is measured using an ultrasound probe or vital data regarding a subject is acquired to select an appropriate injection needle and determine suitability of injection to a corresponding body region, which ensures safe and effective drug administration. In the ultrasound apparatus and the control method thereof, a map containing results of selection of an appropriate injection needle and determination of injection suitability is generated and provided to a patient, which ensures safe self-administration by the patient without a hospital visit. The ultrasound apparatus includes a data acquirer to acquire ultrasound data regarding a subject, a thickness calculator to calculate the thickness of subcutaneous tissue inside the subject based on the ultrasound data, and a needle selector to select a needle corresponding to the calculated thickness of subcutaneous tissue.

    Abstract translation: 公开了一种超声波装置及其控制方法,其中使用超声波探头测量皮下组织的厚度,获取关于受试者的重要数据以选择适当的注射针并确定对相应身体区域的注射适应性,其中 确保安全有效的药物管理。 在超声波装置及其控制方法中,生成包含适当注射针的选择结果和注射适应性的判定的映射图,并提供给患者,这确保患者在不进行医院访问的情况下安全地进行自我管理。 超声波装置包括获取关于被检体的超声波数据的数据获取部,基于超声波数据计算被检体内的皮下组织的厚度的厚度计算部,以及选择针对计算出的皮下组织厚度的针的针选择器 。

    CAPACITIVE DEIONIZATION APPARATUS
    2.
    发明申请
    CAPACITIVE DEIONIZATION APPARATUS 审中-公开
    电容分解装置

    公开(公告)号:US20130206598A1

    公开(公告)日:2013-08-15

    申请号:US13690206

    申请日:2012-11-30

    CPC classification number: C02F1/4691 C02F2001/46138

    Abstract: A capacitive deionization apparatus provided with an electrode including ferroelectrics having a high dielectric constant, the capacitive deionization apparatus including an electrode including a cathode and an anode while having at least one of the cathode and the anode formed using dielectric material, and a power source unit configured to apply a voltage to the electrode.

    Abstract translation: 一种具有包括具有高介电常数的铁电体的电极的电容去离子装置,所述电容去离子装置包括具有阴极和阳极的电极,同时具有使用电介质材料形成的至少一个阴极和阳极;以及电源单元 被配置为向电极施加电压。

    X-RAY IMAGING APPARATUS AND CONTROL METHOD FOR THE SAME
    3.
    发明申请
    X-RAY IMAGING APPARATUS AND CONTROL METHOD FOR THE SAME 审中-公开
    X射线成像装置及其控制方法

    公开(公告)号:US20170042491A1

    公开(公告)日:2017-02-16

    申请号:US15202012

    申请日:2016-07-05

    CPC classification number: A61B6/0414 A61B6/025 A61B6/0407 A61B6/502 A61B6/542

    Abstract: An X-ray imaging method and an apparatus having an improved structure configured to reduce pain and discomfort during a procedure. The X-ray imaging apparatus acquires an X-ray image by compressing an object that is irradiated by an X-ray source. An X-ray detector includes an object contact material that contacts the object. X-rays that pass through the object are detected X-rays, an electrical signal is generated based on the X-rays. A paddle is disposed between the X-ray source and the X-ray detector to be vertically adjustable relative to the X-ray source and X-ray detector so as to compress the object placed on the object contact surface. The paddle includes a supporting member, a pressure member coupled to the supporting member, and at least one adjustment member arranged between the supporting member and the pressure member to regulate movement of the pressure member according to the shape of the object.

    Abstract translation: 一种X射线成像方法和具有改进结构的装置,其被配置为在手术过程中减轻疼痛和不适。 X射线成像装置通过压缩由X射线源照射的物体来获取X射线图像。 X射线检测器包括接触物体的物体接触材料。 通过物体的X射线被检测X射线,基于X射线产生电信号。 在X射线源和X射线检测器之间设置有相对于X射线源和X射线检测器可垂直调节的桨,以便压缩放置在物体接触表面上的物体。 桨叶包括支撑构件,联接到支撑构件的压力构件和布置在支撑构件和压力构件之间的至少一个调节构件,以根据物体的形状来调节压力构件的运动。

    CHIP BONDING APPARATUS
    5.
    发明申请
    CHIP BONDING APPARATUS 审中-公开
    芯片连接装置

    公开(公告)号:US20130248114A1

    公开(公告)日:2013-09-26

    申请号:US13826446

    申请日:2013-03-14

    Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.

    Abstract translation: 接合装置包括至少一个级单元,用于支撑其上具有芯片的电路板和耦合到级单元的接合单元以限定腔室。 接合单元具有至少一个感应加热器以加热以将芯片结合到电路板,并且平台单元包括配置成在平台单元和电路板之间产生真空的真空发生器。 在将芯片接合到电路板时,真空用于将电路板保持在平台单元上。 感应加热器可以包括一个或多个感应加热天线,并且腔室可以包括一个或多个平台单元。

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