中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.022 seconds)

    MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME
    2.
    发明申请
    MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20210116791A1

    公开(公告)日：2021-04-22

    申请号：US16884443

    申请日：2020-05-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjin KANG ,  Hyunsu JUN ,  Younggyu JUNG

    IPC: G03B17/17 ,  G02B27/10 ,  G02B17/02 ,  H04M1/02

    Abstract: A multi-input folded camera includes a plurality of folding devices, a common lens array, and a sensor. The folding devices change paths lights that are incident to the folding devices and output a plurality of folded lights propagating along a plurality of paths. The common lens array combines the folded lights received through an input surface of the common lens array to output a combined light through an output surface of the common lens array. The sensor is at an optical axis of the common lens array to receive the combined light. Performance of a mobile device including the multi-input folded camera is enhanced by sufficient light amounts using the multiple folding devices and combining the lights through the multiple light paths. In implementing an under display camera (UDC), an entire-region display is supported without an aperture in a display panel.

    CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME
    3.
    发明申请
    CAMERA MODULE AND IMAGING APPARATUS INCLUDING THE SAME 有权

    公开(公告)号：US20220132011A1

    公开(公告)日：2022-04-28

    申请号：US17570500

    申请日：2022-01-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunsu JUN ,  Kihyun KWON ,  Seunghak LEE

    IPC: H04N5/225

    Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.

    MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME
    4.
    发明申请
    MULTI-INPUT FOLDED CAMERA AND MOBILE DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20220317550A1

    公开(公告)日：2022-10-06

    申请号：US17845317

    申请日：2022-06-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjin KANG ,  Hyunsu JUN ,  Younggyu JUNG

    IPC: G03B17/17 ,  H04M1/02 ,  G02B17/02 ,  G02B27/10

    Abstract: A multi-input folded camera includes a plurality of folding devices, a common lens array, and a sensor. The folding devices change paths lights that are incident to the folding devices and output a plurality of folded lights propagating along a plurality of paths. The common lens array combines the folded lights received through an input surface of the common lens array to output a combined light through an output surface of the common lens array. The sensor is at an optical axis of the common lens array to receive the combined light. Performance of a mobile device including the multi-input folded camera is enhanced by sufficient light amounts using the multiple folding devices and combining the lights through the multiple light paths. In implementing an under display camera (UDC), an entire-region display is supported without an aperture in a display panel.

    SENSOR DEVICE
    5.
    发明申请
    SENSOR DEVICE 有权

    公开(公告)号：US20210134871A1

    公开(公告)日：2021-05-06

    申请号：US16904895

    申请日：2020-06-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunsu JUN

    IPC: H01L27/146

    Abstract: A sensor device including an interposer including a first via and a lower pad, the lower pad being on a bottom surface of the interposer; an image sensor chip on a top surface of the interposer, the image sensor chip including a logic chip and a sensing chip on the logic chip, the logic chip including first wiring patterns and a second via, and the sensing chip including second wiring patterns; a conductive structure penetrating a portion of the logic chip and the sensing chip, the conductive structure being connected to at least one of the first wiring patterns and at least one of the second wiring patterns; and a passivation layer on an inner surface of the conductive structure, wherein a side surface of the interposer is coplanar with a side surface of the image sensor chip.

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体封装及其制造方法

    公开(公告)号：US20160260761A1

    公开(公告)日：2016-09-08

    申请号：US15049002

    申请日：2016-02-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunsu JUN

    IPC: H01L27/146

    CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/00

    Abstract: A semiconductor package according to the inventive concepts includes an image sensor chip mounted on a substrate, a first holder disposed on an edge area of the image sensor chip, a second holder disposed laterally spaced apart from the image sensor chip on an edge area of the substrate, a molding part provided in a gap region between the first holder and the second holder on the substrate, and a transparent cover disposed on the first holder and the molding part.

    Abstract translation: 根据本发明的半导体封装包括安装在基板上的图像传感器芯片，设置在图像传感器芯片的边缘区域上的第一保持器，在图像传感器芯片的边缘区域上与图像传感器芯片横向间隔开的第二保持器 基板，设置在基板上的第一保持架和第二保持架之间的间隙区域中的成型部，以及设置在第一保持件和成型部上的透明盖。

Patent Agency Ranking