公开(公告)号：US20240162194A1

公开(公告)日：2024-05-16

申请号：US18421198

申请日：2024-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaekyung YOO ,  Jayeon LEE ,  Jae-eun LEE ,  Yeongkwon KO ,  Jin-woo PARK ,  Teak Hoon LEE

IPC: H01L25/065 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

公开(公告)号：US20230088032A1

公开(公告)日：2023-03-23

申请号：US18059747

申请日：2022-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaekyung YOO ,  Jayeon LEE ,  Jae-eun LEE ,  Yeongkwon KO ,  Jin-woo PARK ,  Teak Hoon LEE

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L25/00

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

公开(公告)号：US20210366876A1

公开(公告)日：2021-11-25

申请号：US17140241

申请日：2021-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaekyung YOO ,  Jayeon LEE ,  Jae-eun LEE ,  Yeongkwon KO ,  Jin-woo PARK ,  Teak Hoon LEE

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L25/00

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.