-
公开(公告)号:US20230205092A1
公开(公告)日:2023-06-29
申请号:US17954975
申请日:2022-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Arin LEE , Kiho YANG , Jeeeun JUNG , Sungyong MOON , Junyoung JANG
IPC: G03F7/20 , G06F30/398
CPC classification number: G03F7/70441 , G03F7/705 , G06F30/398
Abstract: An optical proximity correction (OPC) method for manufacturing a semiconductor chip including detecting edges of an initial layout pattern and determining an edge violating a mask rule, among the edges, as a target edge, setting a reference control point (RCP) on the target edge, forming a multi-edge by dividing the target edge based on the RCP, setting additional control points on the multi-edge, forming a modified layout pattern by transforming the multi-edge into a curved edge based on the RCP and the additional control points, performing an OPC simulation based on the modified layout pattern, and calculating an edge placement error (EPE) of the modified layout pattern based on a result of the OPC simulation may be provided.
-
2.
公开(公告)号:US20170017748A1
公开(公告)日:2017-01-19
申请号:US15058300
申请日:2016-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeeeun JUNG , Jeonghoon LEE
Abstract: Provided is a method of generating test patterns. The method includes generating a first polygon, disposing the first polygon in a pattern region, selecting one region from peripheral regions of the first polygon, generating a second polygon, disposing the second polygon in the selected region, and repeating the above processes.
Abstract translation: 提供了一种产生测试图案的方法。 该方法包括生成第一多边形,将第一多边形布置在图案区域中,从第一多边形的周边区域选择一个区域,生成第二多边形,将第二多边形布置在所选择的区域中,并重复上述处理。
-