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公开(公告)号:US20170251569A9
公开(公告)日:2017-08-31
申请号:US14671924
申请日:2015-03-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Ho Yoo , Jeong-Nam Cheon
CPC classification number: H05K7/20336 , H05K1/0203 , H05K7/02 , H05K9/0026 , H05K9/0084
Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.
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公开(公告)号:US10401397B2
公开(公告)日:2019-09-03
申请号:US14174375
申请日:2014-02-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Ho Lim , Sang-Ho Lee , Chea-Ok Ko , Jong-Wan Shim , Jeong-Nam Cheon
Abstract: A method of extracting an Integrated Circuit (IC) current is provided. The method includes generating a transfer function value by using a voltage measured in a node nearest an input terminal of the IC, substituting the generated transfer function value for a reverse fast Fourier transform function, so as to extract the IC voltage, and extracting the IC current from the extracted IC voltage through a simulation in a time domain.
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公开(公告)号:US10010012B2
公开(公告)日:2018-06-26
申请号:US14671924
申请日:2015-03-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Ho Yoo , Jeong-Nam Cheon
CPC classification number: H05K7/20336 , H05K1/0203 , H05K7/02 , H05K9/0026 , H05K9/0084
Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.
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公开(公告)号:US10547108B2
公开(公告)日:2020-01-28
申请号:US15698538
申请日:2017-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sin-Hyung Jeon , Kwang-Ho Kim , Sang-Gi Oh , Sang-Hyuk Wi , Dong-Hyun Jeong , Jeong-Nam Cheon
Abstract: Various embodiments of the present disclosure provide an antenna device and/or an electronic device including the antenna device. The antenna device may include: a circuit board; a conductive layer disposed in a partial region of the circuit board; a first radiation conductor disposed at one side of the conductive layer on the circuit board; and second radiation conductors disposed at one side of the conductive layer on the circuit board, the second radiation conductors being respectively disposed at opposite sides of the first radiation conductor to be symmetrical to each other. The first radiation conductor may transmit or receive a wireless signal in a first frequency band, and the second radiation conductors may transmit or receive a wireless signal in a second frequency band that is different from the first frequency band.
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5.
公开(公告)号:US20150282387A1
公开(公告)日:2015-10-01
申请号:US14671924
申请日:2015-03-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Ho Yoo , Jeong-Nam Cheon
CPC classification number: H05K7/20336 , H05K1/0203 , H05K7/02 , H05K9/0026 , H05K9/0084
Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.
Abstract translation: 提供电子设备。 电子设备包括印刷电路板,布置在印刷电路板上的至少一个电子部件,设置在印刷电路板上以屏蔽至少一个电子部件的屏蔽罩,以及至少一个热管, 屏蔽的一部分可以。
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