公开(公告)号：US08952517B2

公开(公告)日：2015-02-10

申请号：US13831367

申请日：2013-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heungkyu Kwon ,  JeongOh Ha

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15172 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided are a package-on-package device and a method of fabricating the same. In the device, solder balls may be disposed on two opposing side regions of a package substrate, such that the device can have a reduced size or width. In addition, input/output pads of the logic chip and the solder balls, which need to be directly connected to each other, can be disposed adjacent to each other. As a result, it is possible to improve routability of signals to and from the solder balls and to reduce the lengths of the interconnection lines. Accordingly, it is possible to reduce any signal interference, to increase signal delivery speed, and to improve signal-quality and power-delivery properties.

Abstract translation: 提供了一种封装封装器件及其制造方法。 在该器件中，焊球可以设置在封装衬底的两个相对的侧面区域上，使得该器件可以具有减小的尺寸或宽度。 此外，逻辑芯片的输入/输出焊盘和需要彼此直接连接的焊球可以彼此相邻地布置。 结果，可以提高信号到焊球和从焊球的路由性，并且减小互连线的长度。 因此，可以减少任何信号干扰，提高信号传递速度，并且改善信号质量和功率传送性能。