公开(公告)号：US10006646B2

公开(公告)日：2018-06-26

申请号：US15085143

申请日：2016-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Hoon Kim ,  Kyo Seung Kim ,  Tae Il Kim ,  Ji-Ho Baek ,  Youn Sang Jang ,  Sun-Muk Choi ,  Seung Kwan Choi ,  Sung Goo Kim

IPC: F25D23/12 ,  F24F1/24 ,  F24F1/30 ,  B22D17/00 ,  B22D21/00 ,  B22C21/14 ,  B22D19/00 ,  H05K7/20 ,  F28F21/08 ,  F28D21/00 ,  F16K15/03 ,  F28F3/12

CPC classification number: F24F1/24 ,  B22C21/14 ,  B22D17/00 ,  B22D19/0072 ,  B22D21/007 ,  F16K15/03 ,  F24F1/30 ,  F28D2021/0029 ,  F28F3/12 ,  F28F21/084 ,  H05K7/20918 ,  H05K7/20927

Abstract: An outdoor unit of an air conditioner is provided. The outdoor unit may include a compressor for compressing a refrigerant; a condenser for condensing the refrigerant discharged from the compressor; a control device for containing electronic parts to control the outdoor unit; and a cooling unit in contact with a heat generating part of the electronic parts to cool the heat generating part, wherein the cooling unit comprises a first heat radiation member installed to be in contact with the heat generating part; a refrigerant pipe extending through the first heat radiation member and enabling a refrigerant to flow through the refrigerant pipe; and a second heat radiation member coupled with the first heat radiation member for heat transfer and installed to be in contact with air flowing into the control device.

公开(公告)号：US10856442B2

公开(公告)日：2020-12-01

申请号：US15298437

申请日：2016-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang Ho Choi ,  Wang Byung Chae ,  Tae Woo Kang ,  Kyo Seung Kim ,  Hyeon U Park ,  Ji-Ho Baek ,  Sung Hee Lee ,  Youn Sang Jang ,  Tae Sung Choi ,  Seung Ho Hong

IPC: H05K7/20 ,  F24F1/24 ,  B23P15/26

Abstract: An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.