公开(公告)号：US20180315698A1

公开(公告)日：2018-11-01

申请号：US16029030

申请日：2018-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu Kim ,  Taehun Kim ,  JiSun Hong ,  Byungmoon Bae ,  Se-Ho You

IPC: H01L23/498 ,  H01L23/60

CPC classification number: H01L23/49838 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

公开(公告)号：US10256181B2

公开(公告)日：2019-04-09

申请号：US16029030

申请日：2018-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu Kim ,  Taehun Kim ,  JiSun Hong ,  Byungmoon Bae ,  Se-Ho You

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/60 ,  H01L23/29

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

公开(公告)号：US10032706B2

公开(公告)日：2018-07-24

申请号：US15236868

申请日：2016-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu Kim ,  Taehun Kim ,  JiSun Hong ,  Byungmoon Bae ,  Se-Ho You

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/60 ,  H01L23/29

CPC classification number: H01L23/49838 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.