利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

69 条记录 (耗时 0.031 秒)

    ELECTRONIC DEVICE AND CONTROLLING METHOD OF ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE AND CONTROLLING METHOD OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230297832A1

    公开(公告)日：2023-09-21

    申请号：US18201405

    申请日：2023-05-24

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Eunkyu OH ,  Taehun Kim ,  Minsoo Kim ,  Yunhu Ji ,  Sushill Khyalla

    IPC分类号： G06N3/08 ,  G06N3/0455

    CPC分类号： G06N3/08 ,  G06N3/0455

    摘要： An electronic device is provided. The electronic device includes: a memory storing a neural network model; and a processor configured to: obtain a plurality of individual graphs based on an access history for a plurality of contents over a plurality of sessions; generate an integrated graph, in which the plurality of individual graphs are integrated, based on a connection relationship between nodes included in the plurality of individual graphs and a number of times each connection between the nodes is repeated; obtain a plurality of augmented graphs by augmenting each of the plurality of individual graphs based on the integrated graph; and train the neural network model to provide recommended content based on the plurality of augmented graphs.

    Stacked semiconductor package
    6.
    发明授权
    Stacked semiconductor package 有权

    公开(公告)号：US11508685B2

    公开(公告)日：2022-11-22

    申请号：US16992895

    申请日：2020-08-13

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Jihwan Suh ,  Un-Byoung Kang ,  Taehun Kim ,  Hyuekjae Lee ,  Jihwan Hwang ,  Sang Cheon Park

    IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/18

    摘要： A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.

    Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same
    8.
    发明授权
    Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same 有权

    公开(公告)号：US11309228B2

    公开(公告)日：2022-04-19

    申请号：US16908128

    申请日：2020-06-22

    申请人： Samsung Electronics Co., Ltd.

    发明人： Sunchul Kim ,  Taehun Kim ,  Pyoungwan Kim

    IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/373

    摘要： A packaged semiconductor device includes a package substrate, a first semiconductor device on the package substrate, and at least one second semiconductor device that extends on and partially covers the first semiconductor device. A heat dissipating insulation layer is provided as a coating on the first and second semiconductor devices. A conductive heat dissipation member is provided, which extends upwardly from the heat dissipating insulation layer and on portions of the first and second semiconductor devices. A protective member is provided on the package substrate, to cover the first and second semiconductor devices and the conductive heat dissipation member. This protective member includes a first covering portion, which covers an upper surface of the conductive heat dissipation member.