公开(公告)号：US20240377840A1

公开(公告)日：2024-11-14

申请号：US18640395

申请日：2024-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehyun Yoon ,  Jungjun Park ,  Jongbeom Park ,  Kongwoo Lee

IPC: G05D1/656 ,  G05D105/20 ,  G05D107/70

Abstract: An automatic guided vehicle assembly includes a non-powered cart having a shelf unit configured to receive parts or tools, and an automated guided vehicle configured to attach and detach from the non-powered cart and configured to perform autonomous driving, wherein the automated guided vehicle includes a fastening pin configured to move upwardly and downwardly to attach to or detach the automated guided vehicle from the non-powered cart, wherein the non-powered cart includes a fastening unit configured to attach to and detach from the automated guided vehicle, and wherein the fastening unit includes a fastening member having a fastening guide configured to guide coupling of the fastening pinto the fastening unit.

公开(公告)号：US20250022812A1

公开(公告)日：2025-01-16

申请号：US18642633

申请日：2024-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansung Ryu ,  Jongbeom Park

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a first semiconductor chip that includes a first semiconductor substrate that includes an active surface and an inactive surface opposite to each other and a plurality of first through silicon vias that penetrate through the first semiconductor substrate, and a plurality of second semiconductor chips that each include a second semiconductor substrate that includes an active surface and an inactive surface opposite to each other and a plurality of second through silicon vias that penetrates through the second semiconductor substrate. Each of the plurality of second semiconductor chips is stacked on the first semiconductor chip, such that the active surface of each second semiconductor substrate faces the inactive surface of the first semiconductor substrate, and the plurality of second semiconductor chips have the same vertical height.

公开(公告)号：US20240105657A1

公开(公告)日：2024-03-28

申请号：US18240273

申请日：2023-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansung Ryu ,  Yongsung Park ,  Jongbeom Park ,  Junho Lee ,  Jihyun Lee

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13113 ,  H01L2224/13541 ,  H01L2224/13583 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2924/384

Abstract: A semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.

公开(公告)号：US11818850B2

公开(公告)日：2023-11-14

申请号：US17582590

申请日：2022-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungjin Lee ,  Jongbeom Park

IPC: B23K1/00 ,  H05K3/40 ,  B23K1/20

CPC classification number: H05K3/4007 ,  B23K1/203 ,  H05K2203/0126

Abstract: A flux dotting tool is provided that includes: a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing; a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins includes a flux holding portion extending in a first direction and that is exposed to the outside of the housing, and a flux blocking structure protruding in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction.

公开(公告)号：US20230007787A1

公开(公告)日：2023-01-05

申请号：US17582590

申请日：2022-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Seungjin LEE ,  Jongbeom Park

IPC: H05K3/40 ,  B23K1/20

Abstract: A flux dotting tool is provided that includes: a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing; a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins includes a flux holding portion extending in a first direction and that is exposed to the outside of the housing, and a flux blocking structure protruding in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction.