公开(公告)号：US20240379345A1

公开(公告)日：2024-11-14

申请号：US18394524

申请日：2023-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin Hwang ,  Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Jisu Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjoon Park ,  Jungjun Park ,  Jooyoung Park ,  Junhyeok Park ,  Hoseok Song ,  Chiho Ahn ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung

IPC: H01L21/02 ,  G06T7/00

Abstract: An apparatus for cleaning a semiconductor fabrication chamber may include a cleaning module, an inspection module and a drive module. The cleaning module may clean an inner area of the semiconductor fabrication chamber in a non-contact manner. The inspection module may be configured to inspect a cleaning of the semiconductor fabrication chamber by the cleaning module. The drive module may be configured to move the cleaning module and the inspection module in the semiconductor fabrication chamber. Thus, the non-contact type cleaning module may effectively remove the contaminant on an inner wall of the semiconductor fabrication chamber having a complicated shape and/or a part on the inner wall of the semiconductor fabrication chamber having a complicated shape.

公开(公告)号：US20240375293A1

公开(公告)日：2024-11-14

申请号：US18437837

申请日：2024-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungjoon Park ,  Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Jisu Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjun Park ,  Jooyoung Park ,  Junhyeok Park ,  Hoseok Song ,  Chiho Ahn ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung ,  Jeongmin Hwang

IPC: B25J15/00 ,  B25J13/08

Abstract: An in-chamber maintenance apparatus may include a stage module including a stage body in a chamber having a hollow interior, an XY stage mounted on an upper surface of the stage body and movable in an X-axis and a Y-axis direction perpendicular to each other, and a first driving portion configured to drive the XY stage, and a gripper module including a gripper body coupled to an upper surface of the XY stage, a gripping portion supported by the gripper body and configured to move up and down and rotate with respect to a Z-axis perpendicular to the X-axis and the Y-axis to be inserted into the hollow interior, and a second driving portion configured to drive the gripping portion.

公开(公告)号：US20240178025A1

公开(公告)日：2024-05-30

申请号：US18217020

申请日：2023-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoong Choi ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Kyusang Lee ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67288 ,  H01L21/67265 ,  H01L21/67742 ,  H01L21/681

Abstract: A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.

公开(公告)号：US12224191B2

公开(公告)日：2025-02-11

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20240353484A1

公开(公告)日：2024-10-24

申请号：US18591091

申请日：2024-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyuk Choi ,  Sumin Park ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Jayul Kim

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2893

Abstract: A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.

公开(公告)号：US12217984B2

公开(公告)日：2025-02-04

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US20240377840A1

公开(公告)日：2024-11-14

申请号：US18640395

申请日：2024-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehyun Yoon ,  Jungjun Park ,  Jongbeom Park ,  Kongwoo Lee

IPC: G05D1/656 ,  G05D105/20 ,  G05D107/70

Abstract: An automatic guided vehicle assembly includes a non-powered cart having a shelf unit configured to receive parts or tools, and an automated guided vehicle configured to attach and detach from the non-powered cart and configured to perform autonomous driving, wherein the automated guided vehicle includes a fastening pin configured to move upwardly and downwardly to attach to or detach the automated guided vehicle from the non-powered cart, wherein the non-powered cart includes a fastening unit configured to attach to and detach from the automated guided vehicle, and wherein the fastening unit includes a fastening member having a fastening guide configured to guide coupling of the fastening pinto the fastening unit.

公开(公告)号：US11804393B2

公开(公告)日：2023-10-31

申请号：US17718574

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Jonghwi Seo ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67745 ,  H01L21/67167 ,  H01L21/68707

Abstract: A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

公开(公告)号：US20230080991A1

公开(公告)日：2023-03-16

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US20240379384A1

公开(公告)日：2024-11-14

申请号：US18608633

申请日：2024-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjoon Park ,  Jungjun Park ,  Jooyoung Park ,  Hoseok Song ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung ,  Jeongmin Hwang ,  Jisu Kim ,  Junhyeok Park ,  Chiho Ahn

IPC: H01L21/67

Abstract: The present disclosure relates to wire grippers, wire processing apparatuses, and wire processing methods. An example wire gripper comprises a gripper body, a wire supply in the gripper body and supplying a wire, a wire cutting section including a cutter that cuts the wire supplied from the wire supply, a pressure roller below the wire supply and providing a guide groove to guide the wire supplied from the wire supply, a twister on a side of the pressure roller, and a reloader that drives an end of the wire to move from the wire supply to the twister. The twister holds and twists the end of the wire guided by the pressure roller.