公开(公告)号：US20250060905A1

公开(公告)日：2025-02-20

申请号：US18513498

申请日：2023-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghyeon KIM ,  Soogil JEONG

IPC: G06F3/06

Abstract: A computational storage unit is disclosed. The computational storage unit may include a storage for a data and a controller to read the data from the storage. The computational storage unit may also include a computational engine to implement a function to process the data and generate a result. The computational storage unit may receive a command from a host processor and read the data from the storage, execute the function to process the data and generate the result, and return the result to the host processor based at least in part on the command.

公开(公告)号：US20230387026A1

公开(公告)日：2023-11-30

申请号：US18098972

申请日：2023-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEONGHO SHIN ,  Jonghyeon KIM

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L25/18 ,  H05K1/11

CPC classification number: H01L23/5383 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/16 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/73 ,  H01L23/481 ,  H01L25/18 ,  H05K1/116 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/10234 ,  H05K2201/2081

Abstract: Disclosed is a semiconductor package comprising a solder ball, a printed circuit board on the solder ball, a bump on the printed circuit board, and a semiconductor chip on the bump. The printed circuit board includes a base substrate, a low-k dielectric layer that penetrates the base substrate, a connection conductive structure electrically connected to the bump and surrounded by the low-k dielectric layer, and a lower conductive structure electrically connected to the solder ball and the connection conductive structure. A top surface of the lower conductive structure is in contact with a first bottom surface of the low-k dielectric layer.