公开(公告)号：US20250125179A1

公开(公告)日：2025-04-17

申请号：US19002471

申请日：2024-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H10H20/01

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US12230528B2

公开(公告)日：2025-02-18

申请号：US18312655

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62

Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

公开(公告)号：US12148859B2

公开(公告)日：2024-11-19

申请号：US18144566

申请日：2023-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik Hwang ,  Sungjin Kang ,  Kyungwook Hwang ,  Junhee Choi

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

Abstract: A light-emitting diode (LED) includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first electrode pad, a second electrode pad and a third electrode pad disposed on the second semiconductor layer in a direction from a corner of the second semiconductor layer to an opposite corner of the second semiconductor layer. An LED includes a first electrode pad disposed at a center of the LED and in contact with a P-type semiconductor layer and a second electrode pad in contact with an N-type semiconductor layer, wherein the second electrode pad is disposed a maximum distance away from the first electrode pad on the same surface.

公开(公告)号：US11888085B2

公开(公告)日：2024-01-30

申请号：US18180602

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20230261163A1

公开(公告)日：2023-08-17

申请号：US18138339

申请日：2023-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/46 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.

公开(公告)号：US20230231072A1

公开(公告)日：2023-07-20

申请号：US18180602

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo HONG ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20230084493A1

公开(公告)日：2023-03-16

申请号：US17990953

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US20220285188A1

公开(公告)日：2022-09-08

申请号：US17506154

申请日：2021-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang ,  Dongho Kim ,  Joonyong Park

IPC: H01L21/673 ,  H01L33/20 ,  H01L33/62 ,  B65G47/90

Abstract: Provided is a display transfer structure including a substrate including a plurality of wells, and a plurality of light emitting elements disposed in the plurality of wells, wherein the plurality of light emitting elements have a rotationally asymmetric planar shape, and wherein the plurality of wells respectively have a planar shape different from a planar shape of each of the plurality of light emitting elements.

公开(公告)号：US12205931B2

公开(公告)日：2025-01-21

申请号：US18236246

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Sungwoo Hwang

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00

Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

公开(公告)号：US12165571B2

公开(公告)日：2024-12-10

申请号：US18085162

申请日：2022-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Junsik Hwang ,  Geonwook Yoo ,  Hojin Lee ,  Yongchan Kim ,  Kyungwook Hwang

IPC: G09G3/32

Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.