公开(公告)号：US20240387503A1

公开(公告)日：2024-11-21

申请号：US18788803

申请日：2024-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US11626530B2

公开(公告)日：2023-04-11

申请号：US17171636

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US11455815B2

公开(公告)日：2022-09-27

申请号：US16398543

申请日：2019-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Jinmyoung Kim

IPC: G06V40/13 ,  G06F3/044 ,  G06F3/041

Abstract: A touch-fingerprint complex sensor is provided for detecting a touch and a fingerprint of a user, using a touch pad including a touch region and a fingerprint recognizing region. The touch-fingerprint complex sensor includes a plurality of first electrodes disposed on a substrate, and arranged in parallel in a first direction, a plurality of second electrodes disposed on the substrate, and arranged in parallel in a second direction crossing the first direction, and an insulating layer disposed between the plurality of first electrodes and the plurality of second electrodes. A cross-sectional distance between the plurality of first electrodes and the plurality of second electrodes at intersections of the plurality of first electrodes and the plurality of second electrodes in the touch region excluding the fingerprint recognizing region is greater than that at intersections of the plurality of first electrodes and the plurality of second electrodes in the fingerprint recognizing region.

公开(公告)号：US11151347B1

公开(公告)日：2021-10-19

申请号：US16809164

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongsuk Kim ,  Dongkyun Kim ,  Seogwoo Hong ,  Seokwhan Chung

IPC: G06K9/00

Abstract: A touch-fingerprint complex sensor includes a fingerprint substrate provided in a fingerprint area and a touch area, common electrodes provided above the fingerprint substrate in a direction that is normal to an upper surface of the fingerprint substrate, fingerprint electrodes provided between the fingerprint substrate and the common electrodes in the direction, and touch electrodes provided below the common electrodes and the fingerprint substrate in the direction, wherein a first subset of the common electrodes, and the fingerprint electrodes are provided in the fingerprint area, and a second subset of the common electrodes, and the touch electrodes are provided in the touch area.

公开(公告)号：US10191198B2

公开(公告)日：2019-01-29

申请号：US15351950

申请日：2016-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Dongsik Shim ,  Dongouk Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Sunghoon Lee ,  Jaeseung Chung

IPC: G02B26/08 ,  F21V8/00 ,  H04N13/39 ,  B29C65/48 ,  G02B27/22 ,  H04N13/32 ,  B29L31/34

Abstract: A display apparatus including a directional backlight unit and a method of assembling the display apparatus are disclosed. The display apparatus includes an auxiliary structure coupled to an input coupler and a switch panel module.

公开(公告)号：US09971145B2

公开(公告)日：2018-05-15

申请号：US15220930

申请日：2016-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsik Shim ,  Hongseok Lee ,  Seogwoo Hong ,  Joonyong Park

IPC: G02B26/02 ,  G02B26/04 ,  G09G3/34 ,  F21V8/00

CPC classification number: G02B26/04 ,  G02B6/0051 ,  G02B6/0068 ,  G02B26/023 ,  G09G3/3413 ,  G09G3/3473

Abstract: A mirror display includes a light source, a light guide plate configured to guide light emitted from the light source, a first electrode layer spaced apart from the light guide plate and including at least one first hole, a first spacer provided between the light guide plate and the first electrode layer, a second electrode layer spaced apart from the first electrode layer and including at least one second hole not facing the first hole, and a substrate provided on the second electrode layer.

公开(公告)号：US20250125179A1

公开(公告)日：2025-04-17

申请号：US19002471

申请日：2024-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H10H20/01

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US11888085B2

公开(公告)日：2024-01-30

申请号：US18180602

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/005 ,  H01L25/0753

Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.

公开(公告)号：US20230261163A1

公开(公告)日：2023-08-17

申请号：US18138339

申请日：2023-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/46 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.

公开(公告)号：US20230084493A1

公开(公告)日：2023-03-16

申请号：US17990953

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.