公开(公告)号：US20250040279A1

公开(公告)日：2025-01-30

申请号：US18589834

申请日：2024-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minkwan KIM ,  Jongwoo HONG ,  Jonghyun GO ,  Haneul KIM ,  Chang Kyu LEE ,  Keun Yeong CHO ,  Joonhyuk HWANG

IPC: H01L27/146

Abstract: An image sensor includes a pixel array in which pixels having photoelectric conversion elements are arranged in a matrix, color filters corresponding to the pixels and configured to selectively transmit light of at least two different wavelength bands, and microlenses on the color filters. At least some of the microlenses may have different shapes depending on respective wavelength bands that respective corresponding color filters at least partially overlapping with the at least some microlenses are configured to selectively transmit, such that the at least some microlenses are configured to compensate for chromatic aberration between the lights passing through the respective corresponding color filters.

公开(公告)号：US20190319139A1

公开(公告)日：2019-10-17

申请号：US16211344

申请日：2018-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keun Yeong CHO ,  Ho-Chul JI

IPC: H01L31/0232 ,  H01L31/0216

Abstract: A photodetector structure includes a substrate including a semiconductor film, a light absorption layer which is in contact with the semiconductor film and includes germanium (Ge), on the substrate, a first coating layer which wraps at least a part of a side surface of the light absorption layer, on the substrate, and an optical waveguide which is in contact with the light absorption layer and includes silicon nitride (SiN), on the first coating layer, wherein a lower surface of the optical waveguide is higher than a lower surface of the light absorption layer.

公开(公告)号：US20190265421A1

公开(公告)日：2019-08-29

申请号：US16211712

申请日：2018-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho Chul JI ,  Keun Yeong CHO

IPC: G02B6/42

Abstract: A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.

公开(公告)号：US20190025518A1

公开(公告)日：2019-01-24

申请号：US15883491

申请日：2018-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho Chul JI ,  Keun Yeong CHO

IPC: G02B6/30 ,  G02B6/293 ,  G02B6/34 ,  G02B6/12

Abstract: A semiconductor device includes a first device and a second device. The first device includes at least one waveguide on a first substrate. The second device is on the first device and includes at least one optical fiber on an upper surface of a second substrate, a reflector on the upper surface of the second substrate, and a lens on a lower surface of the second substrate below the reflector. The at least one waveguide to carry light from the reflector and passing through the lens for output to the optical fiber.

公开(公告)号：US20210011231A1

公开(公告)日：2021-01-14

申请号：US17037864

申请日：2020-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keun Yeong CHO ,  Ho-Chul JI

IPC: G02B6/42 ,  H01L31/0232 ,  G02B6/12

Abstract: A photodetector structure includes a substrate including a semiconductor film, a light absorption layer which is in contact with the semiconductor film and includes germanium (Ge), on the substrate, a first coating layer which wraps at least a part of a side surface of the light absorption layer, on the substrate, and an optical waveguide which is in contact with the light absorption layer and includes silicon nitride (SiN), on the first coating layer, wherein a lower surface of the optical waveguide is higher than a lower surface of the light absorption layer.

公开(公告)号：US20190013870A1

公开(公告)日：2019-01-10

申请号：US15889449

申请日：2018-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho-Chul JI ,  Keun Yeong CHO

IPC: H04B10/516 ,  G02B6/42 ,  G02F1/01 ,  H04Q11/00

CPC classification number: H04B10/032 ,  H04Q11/00 ,  H04Q11/0062 ,  H04Q2011/0081

Abstract: A photonic integrated circuit includes a main light source, a redundant light source, a controller, an optical switch, and a modulator. The main light source outputs main light through a main light input waveguide. The redundant light source outputs redundant light through a redundant light transmission waveguide. The controller generates a first switch signal based on a fault state of the main light source. The optical switch selectively provides the redundant light from the redundant light transmission waveguide to a redundant light input waveguide based on the first switch signal. The modulator modulates main light from the main light input waveguide or redundant light from the redundant light input waveguide and outputs a first optical signal.