公开(公告)号：US20170327941A1

公开(公告)日：2017-11-16

申请号：US15395016

申请日：2016-12-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Jin KIM ,  Ki-Woong KIM ,  Joon-Myoung LEE

IPC: C23C14/34 ,  C23C14/08 ,  C23C14/35

CPC classification number: C23C14/3464 ,  C23C14/081 ,  C23C14/225 ,  C23C14/3407 ,  C23C14/345 ,  C23C14/352 ,  H01J37/3405 ,  H01J37/3423

Abstract: A sputtering apparatus includes a chamber configured to provide a space where a deposition process is performed on a substrate, a substrate holder configured to support the substrate within the chamber, and at least one turret-type target assembly located over the substrate, including a plurality of targets mounted thereon and adapted to operatively rotate by a predetermined angle about its longitudinal axis such that any one of the targets is off-axis aligned with respect to a film-deposited surface of the substrate.