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公开(公告)号:US20240413251A1
公开(公告)日:2024-12-12
申请号:US18539890
申请日:2023-12-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyen-Hee LEE , Jin Myoung LEE
IPC: H01L29/786 , H01L29/423 , H01L29/66 , H01L29/778
Abstract: A semiconductor device including a substrate including a first region and a second region, a first active pattern extending in a first direction on the first region, a second active pattern extending in the first direction on the second region, a wall structure extending in the first direction between the first region and the second region and separating the first active pattern and the second active pattern from each other, a first gate structure intersecting the first active pattern on the first region, a first two-dimensional (2D) channel layer including a first transition metal dichalcogenide between the first active pattern and the first gate structure, a second gate structure intersecting the second active pattern on the second region, and a second 2D channel layer including a second transition metal dichalcogenide between the second active pattern and the second gate structure may be provided.
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公开(公告)号:US20230120551A1
公开(公告)日:2023-04-20
申请号:US17736367
申请日:2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyen-Hee LEE , Kyung Soo Kim , Sung Il PARK
IPC: H01L27/092 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/786
Abstract: A semiconductor device is provided. The semiconductor device includes: lower nanosheets; upper nanosheets on the lower nanosheets; gate electrodes on the substrate and provided around each of the nanosheets; a first lower source/drain region on a first side of the first and second gate electrodes; a second lower source/drain region on a second side of the first and second gate electrodes; a first upper source/drain region on the first lower source/drain region; and a second upper source/drain region on the second lower source/drain region. A first length of the second lower source/drain region is greater than a second length of the second upper source/drain region.
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公开(公告)号:US20230378289A1
公开(公告)日:2023-11-23
申请号:US18318123
申请日:2023-05-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung Soo KIM , Kyen-Hee LEE
IPC: H01L29/417 , H01L29/423 , H01L29/06 , H01L29/775 , H01L29/786 , H01L27/088 , H01L29/18
CPC classification number: H01L29/41733 , H01L29/42392 , H01L29/0673 , H01L29/775 , H01L29/78696 , H01L27/088 , H01L29/18
Abstract: A semiconductor device includes a substrate, a two-dimensional material layer on the substrate, the two-dimensional material layer extending in a first direction, a gate structure extending in a second direction intersecting the first direction, the gate structure on the two-dimensional material layer, and a source/drain contact on the substrate. The source/drain contact surrounds each opposing end of the two-dimensional material layer, the source/drain contact includes a first portion in contact with each opposing end of the two-dimensional material layer, the source/drain contact includes a second portion on the first portion, and the second portion has a larger aspect ratio than an aspect ratio of the first portion.
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公开(公告)号:US20230292508A1
公开(公告)日:2023-09-14
申请号:US17961035
申请日:2022-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyen-Hee LEE , Kyungsoo KIM
IPC: H01L27/11582 , H01L27/11519 , H01L27/11524 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L29/417 , H01L29/423
CPC classification number: H01L27/11582 , H01L27/11519 , H01L27/11524 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L29/41733 , H01L29/42392
Abstract: A three dimensional semiconductor device includes first, second, third and fourth source/drain patterns sequentially stacked on a substrate, a contact structure on the first to fourth source/drain patterns and a contact line on the contact structure. The contact structure includes a first active contact on the first source/drain pattern, a second active contact on the second source/drain pattern, a third active contact on the third source/drain pattern, and a fourth active contact on the fourth source/drain pattern. A first vertical extension part of the first active contact is adjacent to one side of the contact structure, and a second vertical extension part of the second active contact is adjacent to the other side of the contact structure. A third vertical extension part of the third active contact is disposed between the first and second vertical extension parts and is closer to the first vertical extension part.
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