SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME AND MANUFACTURING METHODS THEREOF
    1.
    发明申请
    SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME AND MANUFACTURING METHODS THEREOF 有权
    半导体器件,包括其的电子器件及其制造方法

    公开(公告)号:US20150162247A1

    公开(公告)日:2015-06-11

    申请号:US14531987

    申请日:2014-11-03

    Abstract: The disclosure provides semiconductor devices and methods of manufacturing the same. The method includes etching a substrate using a first mask pattern formed on the substrate to form a trench, forming a preliminary device isolation pattern filling the trench and including first and second regions having first thicknesses, forming a second mask pattern on the first region, etching an upper portion of the second region and a portion of the first mask pattern, which are exposed by the second mask pattern, to form a second region having a second thickness smaller than the first thickness, removing the first and second mask patterns, and etching upper portions of the first region and the second region having the second thickness to form a device isolation pattern defining preliminary fin-type active patterns. An electronic device including a semiconductor device and a manufacturing method thereof are also disclosed.

    Abstract translation: 本公开提供半导体器件及其制造方法。 该方法包括使用形成在衬底上的第一掩模图案来蚀刻衬底以形成沟槽,形成填充沟槽的初步器件隔离图案,并且包括具有第一厚度的第一和第二区域,在第一区域上形成第二掩模图案,蚀刻 第二区域的上部和第一掩模图案的一部分被第二掩模图案曝光,以形成具有小于第一厚度的第二厚度的第二区域,去除第一和第二掩模图案,以及蚀刻 所述第一区域的上部和所述第二区域具有第二厚度,以形成限定预备鳍型活性图案的器件隔离图案。 还公开了一种包括半导体器件及其制造方法的电子器件。

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20160043197A1

    公开(公告)日:2016-02-11

    申请号:US14820564

    申请日:2015-08-07

    CPC classification number: H01L29/6681 H01L21/31116 H01L21/76897 H01L29/6656

    Abstract: Provided are a semiconductor device and a fabrication method thereof. The semiconductor device may include a fin-shaped active pattern and a gate electrode provided on a substrate, first and second spacers provided on a sidewall of the gate electrode, impurity regions provided at both sides of the gate electrode, a contact plug electrically connected to one of the impurity regions, and a third spacer enclosing the contact plug and having a top surface positioned at substantially the same level as a top surface of the contact plug.

    Abstract translation: 提供半导体器件及其制造方法。 半导体器件可以包括鳍形有源图案和设置在基板上的栅电极,设置在栅电极的侧壁上的第一和第二间隔物,设置在栅电极两侧的杂质区,电连接到 一个杂质区,以及包围该接触插塞的第三间隔件,并且具有位于该接触插塞顶表面基本相同高度的顶表面。

Patent Agency Ranking