公开(公告)号：US20140264412A1

公开(公告)日：2014-09-18

申请号：US14154902

申请日：2014-01-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Bun YOON ,  Sang Hyun KIM ,  Min Jung PARK ,  Jeong Rok OH ,  Chul Soo YOON

IPC: H01L33/46 ,  H01L33/50

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L2224/32245

Abstract: A semiconductor light emitting device package includes: a light emitting device; a wavelength conversion unit formed in a path of light emitted from the light emitting device and including a mixture of a wavelength conversion material and a glass material; and a reflective film disposed on an upper surface of the wavelength conversion unit and reflecting a partial amount of light emitted from the light emitting device and allowing a partial amount of light emitted from the light emitting device to be transmitted therethrough.

Abstract translation: 一种半导体发光器件封装，包括：发光器件; 波长转换单元，其形成在从所述发光器件发射的光的路径中，并且包括波长转换材料和玻璃材料的混合物; 以及反射膜，其设置在所述波长转换单元的上表面上，并且反射从所述发光器件发射的部分光量，并允许从所述发光器件发射的部分光量透射通过。