公开(公告)号：US20160204314A1

公开(公告)日：2016-07-14

申请号：US14973996

申请日：2015-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Tae HWANG ,  Il Woo PARK ,  Young Sim O ,  Daseul YU ,  Jae Sung YOU ,  Chang Bun YOON

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/58 ,  H01L33/50 ,  H01L33/38

CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/16225 ,  H01L2933/0041

Abstract: A light emitting diode (LED) package includes: a package substrate having a first electrode structure and a second electrode structure; an LED chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the LED chip, having a thickness less than a thickness of the LED chip, and configured to reflect light emitted from the LED chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.

Abstract translation: 发光二极管（LED）封装包括：具有第一电极结构和第二电极结构的封装基板; LED芯片，其设置在所述封装基板的第一表面上方，并且具有附接到所述第一电极结构的第一电极和附着到所述第二电极结构的第二电极; 反射层，设置在所述封装基板的与所述LED芯片分离的所述第一表面之上，所述反射层的厚度小于所述LED芯片的厚度，并且被配置为将从所述LED芯片发射的光反射到给定方向，其中所述波长 转换器具有基本上平行于封装衬底的第一表面的上表面和朝向波长转换器的上表面倾斜的侧表面。

公开(公告)号：US20130161534A1

公开(公告)日：2013-06-27

申请号：US13723855

申请日：2012-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Rak SOHN ,  Seul Gee LEE ,  Chul Soo YOON ,  Chang Bun YOON ,  MIn Jung PARK ,  Sang Hoon AHN

IPC: H01L21/66 ,  G01N21/64 ,  H01L33/00

CPC classification number: H01L22/20 ,  G01J1/0488 ,  G01J3/0251 ,  G01J2001/4252 ,  G01N21/64 ,  H01L22/14 ,  H01L33/005 ,  H01L33/56 ,  H01L2933/0041

Abstract: A method of manufacturing a white light emitting device includes dividing a phosphor sheet into phosphor film units to be applied to individual light emitting diode (LED) devices, measuring light conversion characteristics of the respective phosphor film units, classifying the phosphor film units of the phosphor sheet into a plurality of groups according to measurement results of the light conversion characteristics and combining the phosphor film units classified into the plurality of groups and an LED device having predetermined light characteristics so as to obtain target color characteristics.

Abstract translation: 一种白色发光器件的制造方法，其特征在于，将荧光体片分割为单独的发光二极管（LED）器件的荧光膜单元，测定各荧光膜单元的光转换特性，对荧光体膜的荧光体单元进行分类 根据光转换特性的测量结果将多个组分成多组，并组合分成多组的荧光膜单元和具有预定光特性的LED装置，以获得目标色特性。

公开(公告)号：US20140264412A1

公开(公告)日：2014-09-18

申请号：US14154902

申请日：2014-01-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Bun YOON ,  Sang Hyun KIM ,  Min Jung PARK ,  Jeong Rok OH ,  Chul Soo YOON

IPC: H01L33/46 ,  H01L33/50

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L2224/32245

Abstract: A semiconductor light emitting device package includes: a light emitting device; a wavelength conversion unit formed in a path of light emitted from the light emitting device and including a mixture of a wavelength conversion material and a glass material; and a reflective film disposed on an upper surface of the wavelength conversion unit and reflecting a partial amount of light emitted from the light emitting device and allowing a partial amount of light emitted from the light emitting device to be transmitted therethrough.

Abstract translation: 一种半导体发光器件封装，包括：发光器件; 波长转换单元，其形成在从所述发光器件发射的光的路径中，并且包括波长转换材料和玻璃材料的混合物; 以及反射膜，其设置在所述波长转换单元的上表面上，并且反射从所述发光器件发射的部分光量，并允许从所述发光器件发射的部分光量透射通过。

公开(公告)号：US20170148963A1

公开(公告)日：2017-05-25

申请号：US15238282

申请日：2016-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soo Moon PARK ,  Il Woo PARK ,  Mi Hwa YU ,  Chang Bun YOON

IPC: H01L33/62 ,  H01L33/06 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H05B37/02 ,  F21V8/00 ,  F21V23/02 ,  F21V19/00 ,  F21V29/77 ,  H01L23/00

CPC classification number: H01L33/62 ,  F21V19/006 ,  F21V23/02 ,  F21V29/77 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/0083 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/06 ,  H01L33/145 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L2224/45139 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H05B33/0803 ,  H05B37/0272 ,  H01L2924/00014

Abstract: Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may include a core portion including silver (Ag), and a shell layer surrounding the core portion, having a thickness of 2 nm to 23 nm, and including gold (Au). The semiconductor package may include a package body having a first electrode structure and a second electrode structure, a semiconductor light emitting device comprising a first electrode portion and a second electrode portion electrically connected to the first electrode structure and the second electrode structure, and a bonding wire connecting at least one of the first electrode structure and the second electrode structure to the semiconductor light emitting device.

公开(公告)号：US20160064624A1

公开(公告)日：2016-03-03

申请号：US14738730

申请日：2015-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Bun YOON ,  Sang Hyun KIM ,  Young Taek KIM ,  Jae Hyuk LIM

IPC: H01L33/50 ,  H01L33/32 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L33/06 ,  H01L33/58

CPC classification number: H01L33/504 ,  H01L25/0753 ,  H01L33/22 ,  H01L33/501 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting device package may include: a package board; a semiconductor light emitting device disposed on the package board; and a color characteristics converting unit having a resin including a wavelength conversion material converting light emitted from the semiconductor light emitting device into light of a different wavelength and glass powder having a glass composition with a rare earth element added thereto and filtering light within a particular wavelength band, and disposed on a path on which light emitted from the semiconductor light emitting device travels.

Abstract translation: 发光器件封装可以包括：封装板; 设置在所述封装板上的半导体发光器件; 以及颜色特性转换单元，其具有包括将从半导体发光器件发射的光转换为不同波长的光的波长转换材料的树脂和具有加入稀土元素的玻璃组合物的玻璃粉末，并过滤特定波长内的光 并且设置在从半导体发光器件发射的光行进的路径上。