公开(公告)号：US10913201B2

公开(公告)日：2021-02-09

申请号：US15229981

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Eun-bong Han ,  Young-dae Ko ,  Hyeon-hyang Kim ,  O-hyun Beak ,  Jun-hee Lee ,  Yeon-kyoung Jung

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/00 ,  B29C64/112 ,  B33Y50/02

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

公开(公告)号：US10566293B2

公开(公告)日：2020-02-18

申请号：US15061233

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Young-dae Ko ,  O-hyun Beak ,  Eun-bong Han ,  Hyeon-hyang Kim ,  Yeon-kyoung Jung ,  Il-ju Mun

IPC: H01L23/552 ,  B05B15/20 ,  H05K3/28 ,  H01L23/24 ,  H05K1/02 ,  H01L23/498 ,  H01L23/00

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

公开(公告)号：US10937738B2

公开(公告)日：2021-03-02

申请号：US14991800

申请日：2016-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： O-hyun Beak ,  Keon Kuk ,  Young-chul Ko ,  Woon-bae Kim

IPC: H01L23/552 ,  H04W4/50 ,  H01L23/29 ,  B05C5/00 ,  B05C5/02 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/67 ,  H01L23/48 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L25/10 ,  H01L21/56 ,  H01L25/065

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.