公开(公告)号：US10913201B2

公开(公告)日：2021-02-09

申请号：US15229981

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Eun-bong Han ,  Young-dae Ko ,  Hyeon-hyang Kim ,  O-hyun Beak ,  Jun-hee Lee ,  Yeon-kyoung Jung

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/00 ,  B29C64/112 ,  B33Y50/02

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

公开(公告)号：US10068832B2

公开(公告)日：2018-09-04

申请号：US15840326

申请日：2017-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-bong Han ,  Hyeon-hyang Kim

IPC: H05K1/00 ,  H01L23/552 ,  H01L23/495 ,  H01L23/22 ,  H01L23/427 ,  H05K9/00 ,  H05K7/20 ,  G06F1/20 ,  H05K1/02 ,  H01L23/367 ,  F28D15/02

CPC classification number: H01L23/427 ,  F28D15/0233 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/203 ,  H01L23/3675 ,  H01L23/552 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K3/284 ,  H05K7/20336 ,  H05K7/2099 ,  H05K9/003 ,  H05K9/0088 ,  H05K2201/0367 ,  H05K2201/064

Abstract: An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

公开(公告)号：US10566293B2

公开(公告)日：2020-02-18

申请号：US15061233

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Young-dae Ko ,  O-hyun Beak ,  Eun-bong Han ,  Hyeon-hyang Kim ,  Yeon-kyoung Jung ,  Il-ju Mun

IPC: H01L23/552 ,  B05B15/20 ,  H05K3/28 ,  H01L23/24 ,  H05K1/02 ,  H01L23/498 ,  H01L23/00

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.