公开(公告)号：US20230097611A1

公开(公告)日：2023-03-30

申请号：US18057397

申请日：2022-11-21

Applicant: Samsung Electronics co., Ltd.

Inventor： Jihun CHEON ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

公开(公告)号：US11545373B2

公开(公告)日：2023-01-03

申请号：US16715123

申请日：2019-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihun Cheon ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/30 ,  H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

公开(公告)号：US11742222B2

公开(公告)日：2023-08-29

申请号：US18057397

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihun Cheon ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B7/04 ,  G03F7/30 ,  B08B5/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B5/02 ,  B08B7/0057 ,  B08B7/04 ,  G03F7/30 ,  B08B2203/005

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

公开(公告)号：US20200373174A1

公开(公告)日：2020-11-26

申请号：US16715123

申请日：2019-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： JIHUN Cheon ,  Hyun Jung Lee ,  Pyojin Jeon ,  Yong-Jhin Cho ,  Wonjun Lee

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/02 ,  B08B5/02 ,  B08B7/04 ,  G03F7/30

Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.