公开(公告)号：US08911229B2

公开(公告)日：2014-12-16

申请号：US13780603

申请日：2013-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Yun Lee ,  Seong Wook Cheong ,  Byeong Kap Choi ,  Sang Jin Choi

IPC: B29C45/26 ,  B29C45/02 ,  B29C45/06 ,  B29C45/14 ,  B29C45/46

CPC classification number: B29C45/26 ,  B29C45/02 ,  B29C45/06 ,  B29C45/14655 ,  B29C45/2681 ,  B29C45/46

Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.

Abstract translation: 一种用于制造半导体封装的装置，至少包括第一模具，转子和驱动器。 第一模具具有第一模具部分，第二模具部分和当第一模具部分和第二模具组合在一起时形成的至少一个模腔。 旋转器联接到第一模具，并且驱动器位于第一模具和旋转体的旋转轴线之间。 驱动器基于旋转体在旋转轴线上旋转时产生的离心力将模制树脂提供到腔体中。

公开(公告)号：US10522379B2

公开(公告)日：2019-12-31

申请号：US15707023

申请日：2017-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Wee Kong ,  Kang Min Park ,  Chul Hwan Choi ,  Yong Joon Hong ,  Kang Soo Kim ,  Sang Ho Roh ,  Heok Jae Lee ,  Sang Jin Choi

IPC: B01D9/00 ,  H01L21/677 ,  H01L21/673 ,  F24F3/16 ,  F04D29/70 ,  F04D25/16 ,  F24F13/08 ,  B01D50/00 ,  B01D46/10 ,  B01D46/00 ,  F04D29/66 ,  F24F1/0071

Abstract: A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.

公开(公告)号：US20180122676A1

公开(公告)日：2018-05-03

申请号：US15707023

申请日：2017-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Wee Kong ,  Kang Min Park ,  Chul Hwan Choi ,  Yong Joon Hong ,  Kang Soo Kim ,  Sang-Ho Roh ,  Heok Jae Lee ,  Sang Jin Choi

IPC: H01L21/677 ,  H01L21/673 ,  F24F3/16 ,  F04D29/70

Abstract: A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.