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公开(公告)号:US20170212145A1
公开(公告)日:2017-07-27
申请号:US15415034
申请日:2017-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyeong-mi LEE , Jeong-ju PARK , Shi-yong YI , Eun-sung KIM , Seung-chul KWON , Sang-ouk KIM , Young-joo CHOI
CPC classification number: G01Q60/28 , G01Q60/42 , G01Q70/14 , H01L21/67288 , H01L27/10876 , H01L27/10885 , H01L27/10888 , H01L28/00
Abstract: A method of forming a micropattern, a substrate surface inspection apparatus, a cantilever set for an atomic force microscope, and a method of analyzing a surface of a semiconductor substrate, and a probe tip the method including forming pinning patterns on a semiconductor substrate; forming a neutral pattern layer in spaces between the pinning patterns; and inspecting a surface of a guide layer that includes the pinning patterns and the neutral pattern layer by using an atomic force microscope (AFM).