公开(公告)号：US20170212145A1

公开(公告)日：2017-07-27

申请号：US15415034

申请日：2017-01-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong-mi LEE ,  Jeong-ju PARK ,  Shi-yong YI ,  Eun-sung KIM ,  Seung-chul KWON ,  Sang-ouk KIM ,  Young-joo CHOI

IPC: G01Q60/28 ,  H01L21/67

CPC classification number: G01Q60/28 ,  G01Q60/42 ,  G01Q70/14 ,  H01L21/67288 ,  H01L27/10876 ,  H01L27/10885 ,  H01L27/10888 ,  H01L28/00

Abstract: A method of forming a micropattern, a substrate surface inspection apparatus, a cantilever set for an atomic force microscope, and a method of analyzing a surface of a semiconductor substrate, and a probe tip the method including forming pinning patterns on a semiconductor substrate; forming a neutral pattern layer in spaces between the pinning patterns; and inspecting a surface of a guide layer that includes the pinning patterns and the neutral pattern layer by using an atomic force microscope (AFM).

公开(公告)号：US20170107616A1

公开(公告)日：2017-04-20

申请号：US15262544

申请日：2016-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-young SHIM ,  Eun-sung KIM ,  Chul-hwan CHOI ,  Chung-hwan KIM

IPC: C23C16/455 ,  B08B15/00 ,  B08B7/00 ,  B08B9/08 ,  H01L21/033 ,  B08B5/00

CPC classification number: B08B15/00 ,  B08B7/0035 ,  H01J37/32862 ,  H01L21/0337

Abstract: Provided are a method of fabricating a semiconductor The method of fabricating a semiconductor device includes: transporting a substrate having a carbon-based sacrificial layer pattern to a processing chamber; forming a mask material layer on the substrate; removing the substrate from the processing chamber; and removing at least a part of a carbon-based material layer formed inside the processing chamber.

公开(公告)号：US20130167897A1

公开(公告)日：2013-07-04

申请号：US13729820

申请日：2012-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-young CHOI ,  Seung-hyun BAIK ,  Seung-hyun HONG ,  Won-young KIM ,  Eun-sung KIM ,  Young-hee LEE

IPC: H01L35/22 ,  H01L35/18 ,  H01L35/34 ,  H01L35/16

CPC classification number: H01L35/22 ,  C01B32/184 ,  H01L35/16 ,  H01L35/32 ,  H01L35/34 ,  Y02P20/133

Abstract: A heterogeneous laminate including: graphene; and a thermoelectric inorganic compound disposed on the graphene.

Abstract translation: 异质层压板包括：石墨烯; 以及设置在石墨烯上的热电无机化合物。