公开(公告)号：US09972717B2

公开(公告)日：2018-05-15

申请号：US15228421

申请日：2016-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeong-Jong Jeong ,  Jeong-Yun Lee ,  Geo-Myung Shin ,  Dong-Suk Shin ,  Si-Hyung Lee ,  Seo-Jin Jeong

IPC: H01L27/088 ,  H01L29/78 ,  H01L29/06 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/41 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/423 ,  H01L29/786

CPC classification number: H01L29/7848 ,  B82Y10/00 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823878 ,  H01L27/0886 ,  H01L27/0924 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/413 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78 ,  H01L29/7851 ,  H01L29/7853 ,  H01L29/78696

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device comprises a first multi-channel active pattern which is defined by a field insulating layer, extends along a first direction, and includes a first portion and a second portion; a gate electrode which extends along a second direction different from the first direction and is formed on the first portion; and a first source/drain region which is formed around the second portion protruding further upward than a top surface of the field insulating layer and contacts the field insulating layer, wherein the second portion is disposed on both sides of the first portion in the first direction and is more recessed than the first portion, a top surface of the first portion and a top surface of the second portion protrude further upward than the top surface of the field insulating layer, and a profile of sidewalls of the second portion is continuous.

公开(公告)号：US20160343859A1

公开(公告)日：2016-11-24

申请号：US15228421

申请日：2016-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeong-Jong JEONG ,  Jeong-Yun Lee ,  Geo-Myung Shin ,  Dong-Suk Shin ,  Si-Hyung Lee ,  Seo-Jin Jeong

IPC: H01L29/78 ,  H01L29/161 ,  H01L21/8238 ,  H01L29/165 ,  H01L29/06 ,  H01L27/092 ,  H01L29/08 ,  H01L29/16

CPC classification number: H01L29/7848 ,  B82Y10/00 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823878 ,  H01L27/0886 ,  H01L27/0924 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/413 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78 ,  H01L29/7851 ,  H01L29/7853 ,  H01L29/78696

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device comprises a first multi-channel active pattern which is defined by a field insulating layer, extends along a first direction, and includes a first portion and a second portion; a gate electrode which extends along a second direction different from the first direction and is formed on the first portion; and a first source/drain region which is formed around the second portion protruding further upward than a top surface of the field insulating layer and contacts the field insulating layer, wherein the second portion is disposed on both sides of the first portion in the first direction and is more recessed than the first portion, a top surface of the first portion and a top surface of the second portion protrude further upward than the top surface of the field insulating layer, and a profile of sidewalls of the second portion is continuous.

Abstract translation: 提供半导体器件及其制造方法。 半导体器件包括由场绝缘层限定的第一多沟道有源图案，沿着第一方向延伸，并且包括第一部分和第二部分; 栅极电极，沿着与第一方向不同的第二方向延伸并形成在第一部分上; 以及第一源极/漏极区域，其围绕所述第二部分形成在所述场绝缘层的顶表面之上并且与所述场绝缘层接触的位置，其中所述第二部分设置在所述第一部分的所述第一方向的两侧 并且比第一部分更凹陷，第一部分的顶表面和第二部分的顶表面比场绝缘层的顶表面进一步向上突出，并且第二部分的侧壁的轮廓是连续的。