公开(公告)号：US20210104381A1

公开(公告)日：2021-04-08

申请号：US16871427

申请日：2020-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin JEON ,  Dougyong SUNG ,  Jongwoo SUN ,  Minkyu SUNG ,  Kimoon JUNG ,  Seongha JEONG ,  Ungyo JUNG ,  Jewoo HAN

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/311

Abstract: A gas supply assembly for a substrate processing apparatus includes a gas introduction part, a gas distribution plate connected to the gas introduction part, the gas distribution plate including a plurality of through holes, and a shower head disposed under the gas distribution plate, the shower head including a plurality of distribution holes in fluid communication with the plurality of through holes. One through hole is in fluid communication with at least two distribution holes, and each of the plurality of distribution holes has a first diameter and a second diameter differing from each other in the shower head.

公开(公告)号：US20200335376A1

公开(公告)日：2020-10-22

申请号：US16683707

申请日：2019-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwoo SUN ,  Incheol SONG ,  Hongmin YOON ,  Jihyun LIM ,  Masayuki TOMOYASU ,  Jewoo HAN

IPC: H01L21/683 ,  H01J37/32

Abstract: According to some embodiments, a semiconductor substrate processing apparatus includes a housing, a plasma source unit, an electrostatic chuck, and a ring unit. The housing encloses a process chamber. The plasma source unit is connected to the housing, and includes a shower head and a fixing ring positioned to support the shower head. The shower head includes an upper electrode mounted on the fixing ring, and includes injection holes passing through part of the upper electrode and configured to inject gas into the chamber. The electrostatic chuck is connected to the housing and includes a lower electrode, and is for mounting a semiconductor substrate thereon. The ring unit is mounted on an edge portion of the electrostatic chuck, and includes a focus ring and a cover ring surrounding the focus ring. One of the lower electrode and the upper electrode is connected to a high frequency power supply, and the other of the lower electrode and the upper electrode is connected to ground. The focus ring has an inner side surface, and an opposite outer side surface that contacts the cover ring, and a width between the inner side surface and the outer side surface of the focus ring is a first width. The cover ring has an inner side surface that contacts the outer side surface of the focus ring, and an outer side surface, and a width between the inner side surface and the outer side surface of the cover ring is a second width. The first width is between 2 and 10 time the second width.