公开(公告)号：US20240319265A1

公开(公告)日：2024-09-26

申请号：US18609802

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongkwan LEE ,  Junyeon WON ,  Minho KANG ,  Cheolmin PARK ,  Jaemoo CHOI

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/287

Abstract: A test device for testing a semiconductor, the test device comprising: a pulse signal generator that is configured to generate a first pulse signal and transmit the first pulse signal through channels; a sampler that is configured to receive the first pulse signal through the channels and conduct a sampling process on the first pulse signal, based on a second pulse signal; a width analyzer that is configured to measure a first width of the first pulse signal and generate a first measurement value, based on a result of the sampling process; and a calculator that is configured to output a test result corresponding to each of the channels of the test device, based on the first measurement value.

公开(公告)号：US20250123323A1

公开(公告)日：2025-04-17

申请号：US18628896

申请日：2024-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haewook PARK ,  Sungyeol KIM ,  Junhyung KIM ,  Seongkwan LEE ,  Jaemoo CHOI

IPC: G01R31/28 ,  H01L21/66

Abstract: A semiconductor test device includes a test chamber having at least one device under test disposed therein. A test module tests the at least one device under test. A signal connection device electrically connects the at least one device under test and the test module to each other. The signal connection device includes an electrically conductive thermal insulator (ECTI). The ECTI has electrical conductivity greater than or equal to about 1700 S/cm and thermal conductivity less than or equal to about 2.2 W/mK.

公开(公告)号：US20230047664A1

公开(公告)日：2023-02-16

申请号：US17691290

申请日：2022-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shinki JEONG ,  Hyungsun RYU ,  Seongkwan LEE ,  Jaemoo CHOI

IPC: H04N17/00 ,  H04N5/374

Abstract: A testing system for testing an image sensor, includes a probe card, a pogo block receiving output signals of the probe card, an interface board configured to receive output signals of the pogo block, convert the received output signals of the pogo block, and output the converted signals through a cable, and a testing apparatus connected to the interface board through the cable. The testing apparatus is configured to test the device under test through signals received through the cable. The interface board includes an active interface module configured to amplify the received output signals of the pogo block, convert the amplified signals into signals having a same frequency as the received output signals of the pogo block, and transmit the converted signals to the cable.