公开(公告)号：US20150128663A1

公开(公告)日：2015-05-14

申请号：US14539395

申请日：2014-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seul Gi LEE

IPC: D06F39/08 ,  F16L3/00

CPC classification number: D06F39/083 ,  D06F39/085 ,  D06F39/12 ,  F16L3/003

Abstract: A washing machine includes a cabinet forming an external appearance of the washing machine, a tub provided in the cabinet to accommodate wash water, a drain pump coupled to a drain hose configured to guide wash water pumped by the drain pump to outside of the cabinet, and a holder coupled to an outer surface of the cabinet to fix the drain hose to the cabinet. The holder is coupled to the outer surface of the cabinet while having both ends coupled to each other to form an accommodation hole surrounding the outer circumferential surface of the drain hose, and at least one movement preventing protrusion formed on an inner circumferential surface of the holder to prevent the drain hose from being separated from the holder protrudes toward inside of the holder to come into contact with the outer circumferential surface of the drain hose.

Abstract translation: 一种洗衣机包括形成洗衣机的外观的柜体，设置在机壳中以容纳洗涤水的桶;排水软管，其连接到排水软管，该排水软管构造成将由排水泵泵送的洗涤水引导到柜体外部， 以及联接到机壳的外表面以将排水软管固定到机柜的保持架。 保持器联接到机壳的外表面，同时具有彼此联接的两端以形成围绕排水软管的外周表面的容纳孔，以及形成在保持器的内周表面上的至少一个防止移动突起 以防止排水软管与保持架分离，突出到保持器的内部以与排水软管的外周表面接触。

公开(公告)号：US20240304427A1

公开(公告)日：2024-09-12

申请号：US18538419

申请日：2023-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ki NAM ,  Tae-Hyun KIM ,  Sung Ho JANG ,  Seul Gi LEE

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/32834 ,  H01J37/32449 ,  H01J37/32642 ,  H01L21/67069 ,  H01J2237/3341

Abstract: The present disclosure relates to an internal pressure control apparatus capable of uniformly processing an upper surface of a semiconductor substrate and a substrate processing apparatus including the same. The substrate processing apparatus comprising a chamber housing including an exhaust hole for exhausting a process gas flowing thereinto, a substrate support unit inside the chamber housing, supporting a semiconductor substrate, a process gas supply unit providing the process gas to the inside of the chamber housing, a plasma generating unit generating plasma inside the chamber housing by using the process gas, and a ring body installed around the substrate support unit and provided as one body, and further comprising an internal pressure control apparatus controlling an internal pressure of the chamber housing, wherein the internal pressure control apparatus controls a posture of the ring body to control an exhaust amount of the process gas flowing into the chamber housing.