公开(公告)号：US20220415793A1

公开(公告)日：2022-12-29

申请号：US17696336

申请日：2022-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Hwan KIM ,  Won Ki ROH ,  Na Rae JEONG ,  Seung Uk HAN

IPC: H01L23/528 ,  H01L27/108 ,  G11C5/06 ,  H01L23/522

Abstract: A semiconductor memory device includes a substrate extending in a first direction and second direction perpendicular to the first direction, bitline structures arranged on a substrate in the first direction, the bitline structures extending in the second direction, spacer structures disposed on sidewalls of the bitline structures to extend in the second direction, the spacer structures including spacers, which are formed of air or silicon oxide, contact structures disposed between the spacer structures and arranged in the second direction; fence structures filling gaps between the contact structures and between the spacer structures, and pad isolation films isolating the contact structures on the bitline structures, the spacer structures, and the fence structures. The fence structures include first fence liners and second fence liners, which are on the first fence liners and are formed of one of air and silicon oxide, and which overlap with the spacers in the first direction.

公开(公告)号：US20210098460A1

公开(公告)日：2021-04-01

申请号：US16860276

申请日：2020-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho LEE ,  Eun A KIM ,  Ki Seok LEE ,  Jay-Bok CHOI ,  Keun Nam KIM ,  Yong Seok AHN ,  Jin-Hwan CHUN ,  Sang Yeon HAN ,  Sung Hee HAN ,  Seung Uk HAN ,  Yoo Sang HWANG

IPC: H01L27/108 ,  H01L23/528

Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.

公开(公告)号：US20210408004A1

公开(公告)日：2021-12-30

申请号：US17469340

申请日：2021-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho LEE ,  Eun A KIM ,  Ki Seok LEE ,  Jay-Bok CHOI ,  Keun Nam KIM ,  Yong Seok AHN ,  Jin-Hwan CHUN ,  Sang Yeon HAN ,  Sung Hee HAN ,  Seung Uk HAN ,  Yoo Sang HWANG

IPC: H01L27/108 ,  H01L23/528

Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.