SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240306377A1

    公开(公告)日:2024-09-12

    申请号:US18488229

    申请日:2023-10-17

    CPC classification number: H10B12/485 H10B12/01 H10B12/315

    Abstract: A semiconductor device including a first active pattern and a second active pattern each extending along a first direction and arranged along a second direction intersecting the first direction each of the first and second active patterns including a central part, a first edge part, and a second edge part, a storage node pad on the first edge part of the first active pattern, and a bit-line node contact on the central part of the first active pattern, wherein a top surface of the bit-line node contact is located at a higher level than a top surface of the storage node pad may be provided.

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