公开(公告)号：US20240258224A1

公开(公告)日：2024-08-01

申请号：US18421440

申请日：2024-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungryong Oh ,  Seunghoon Yeon ,  Junho Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49827 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49838 ,  H01L24/08 ,  H01L25/0657 ,  H01L2224/08146 ,  H01L2225/06541

Abstract: A semiconductor package includes a package-bottom redistribution structure at a lower side of a package and including a conductive line, an upper semiconductor chip at an upper side of the package, an upper back end of line (BEOL) layer, at a lower side of the upper semiconductor chip, and including a conductive line, a lower semiconductor chip below the upper semiconductor chip, where a horizontal width of the lower semiconductor chip is less than a horizontal width of the upper semiconductor chip, and where the upper semiconductor chip overlaps at least a portion of the lower semiconductor chip, a lower BEOL layer at a lower side of the lower semiconductor chip and including a conductive line, a passivation layer on an upper surface of the lower semiconductor chip, and a through silicon via (TSV) structure penetrating the passivation layer and the lower semiconductor chip.

公开(公告)号：US20240194575A1

公开(公告)日：2024-06-13

申请号：US18380042

申请日：2023-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungryong Oh ,  Chajea Jo

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49822 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/08146 ,  H01L2224/08168 ,  H01L2224/16147 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/182

Abstract: A semiconductor package includes a first semiconductor chip including a first bonding layer, the first bonding layer including a first chip pad and a first insulating layer covering a side surface of the first chip pad, a second semiconductor chip disposed below the first semiconductor chip and including a substrate having front and rear surfaces, the front surface forming a second bonding layer, and through-electrodes passing through the substrate and having protrusions protruding from the rear surface, the second bonding layer including a second chip pad contacting the first chip pad and a second insulating layer covering a side surface of the second chip pad, a redistribution layer disposed below the second semiconductor chip and electrically connected to the second semiconductor chip, vias disposed between the redistribution layer and the first semiconductor chip and disposed around the second semiconductor chip, and an encapsulant surrounding the second semiconductor chip, the redistribution layer, and the vias. The encapsulant may be in contact with the protrusions of the through-electrodes.

公开(公告)号：US20240243104A1

公开(公告)日：2024-07-18

申请号：US18513863

申请日：2023-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghoon Yeon ,  Seungryong Oh ,  Junho Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/1357 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of electrode bundles arranged in an array in a first substrate and each having a plurality of through electrodes penetrating the first substrate, a backside insulating layer on a backside surface of the first substrate through which end portions of the through electrodes are exposed, and a plurality of electrode pads respectively provided on the electrode bundles. The backside insulating layer has a first trench formed between the through electrodes of a first electrode bundle. A first electrode pad is disposed on the through electrodes of a first electrode bundle and includes a protruding portion that fills the first trench of the backside insulating layer.