METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20150132908A1

    公开(公告)日:2015-05-14

    申请号:US14294429

    申请日:2014-06-03

    CPC classification number: H01L29/66545 H01L29/66795

    Abstract: A semiconductor device and method of fabricating the device, includes forming a fin-type active pattern that projects above a field insulating layer and forming a dummy gate structure that includes an epitaxial growth prevention layer to suppress nodule formation.

    Abstract translation: 一种制造该器件的半导体器件和方法,包括形成在场绝缘层上方突出的鳍状有源图案,并形成包含外延生长防止层的虚拟栅极结构,以抑制结核形成。

Patent Agency Ranking