公开(公告)号：US20240128230A1

公开(公告)日：2024-04-18

申请号：US18322774

申请日：2023-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sinyeop LEE ,  Taegyu KANG ,  Jaeseon HWANG

IPC: H01L23/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/12 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L24/81 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/127 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/18 ,  H10B80/00 ,  H01L2224/13211 ,  H01L2224/13239 ,  H01L2224/16227 ,  H01L2224/75263 ,  H01L2224/759 ,  H01L2224/81224 ,  H01L2224/81379 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1431 ,  H01L2924/1436

Abstract: A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. A soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.