公开(公告)号：US11599021B2

公开(公告)日：2023-03-07

申请号：US17736132

申请日：2022-05-04

Applicant: Samsung Electronics Co., Ltd. ,  Inpria Corporation

Inventor： Chawon Koh ,  Tsunehiro Nishi ,  Brian Cardineau ,  Sangyoon Woo ,  Jason Stowers ,  Soo Young Choi

IPC: G03F7/004 ,  G03F7/11 ,  H01L21/027 ,  H01L21/311 ,  G03F7/20 ,  G03F7/32

Abstract: Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.

公开(公告)号：US11189503B2

公开(公告)日：2021-11-30

申请号：US16420776

申请日：2019-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Hoo Kim ,  Kuntack Lee ,  Yong-Jhin Cho ,  Chawon Koh ,  Sunghyun Park ,  Hyosan Lee ,  Ji Hoon Cha ,  Soo Young Choi

IPC: H01L21/67 ,  H01L21/02

Abstract: Disclosed are substrate drying methods, photoresist developing methods, and/or photolithography methods. The substrate drying method including providing a drying liquid on a substrate, increasing a pressure of the drying liquid to produce a supercritical fluid, and removing the supercritical fluid to dry the substrate may be provided.

公开(公告)号：US11327398B2

公开(公告)日：2022-05-10

申请号：US16399473

申请日：2019-04-30

Applicant: Samsung Electronics Co., Ltd. ,  Inpria Corporation

Inventor： Chawon Koh ,  Tsunehiro Nishi ,  Brian Cardineau ,  Sangyoon Woo ,  Jason Stowers ,  Soo Young Choi

IPC: G03F7/004 ,  G03F7/11 ,  H01L21/027 ,  H01L21/311 ,  G03F7/20 ,  G03F7/32

Abstract: Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.