公开(公告)号：US11038547B2

公开(公告)日：2021-06-15

申请号：US16321413

申请日：2017-07-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Hyangbok Lee ,  Byoung-Ryoul Song ,  Taelee Lee ,  Soonheung Kwon ,  Min-Seok Kim ,  Won-Seob Kim ,  Yoon-Goo Nam ,  Sung-Soo Kim ,  Sigwan Kim ,  Seung-Hwa Shin ,  Taekkyun Choi ,  Young Heo

IPC: H04B1/401 ,  H04B7/0404

Abstract: Various examples of the present invention relate to a device and a method for improving wireless communication performance in an electronic device. The electronic device comprises multiple antennas, a communication circuit connected to the multiple antennas, a connector, and at least one processor, wherein the processor checks whether a wired cable is connected through the connector and, if the wired cable is connected through the connector, can perform control such that communication using the multiple antennas corresponding to the connection of the wired cable is performed. Other examples can be possible.

公开(公告)号：US12009577B2

公开(公告)日：2024-06-11

申请号：US17955770

申请日：2022-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung Kwon ,  Sumin Yun ,  Hosaeng Kim ,  Hyunjeong Lee ,  Hyungjoo Lee

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q5/25 ,  H01Q5/307 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q5/25 ,  H01Q5/307 ,  H01Q9/0407

Abstract: An electronic device includes a housing providing a front surface and a rear surface, an antenna including a printed circuit board within the housing and including a first surface facing the front surface and a second surface facing the rear surface. The printed circuit board includes a first conductive layer including a first antenna element and a second antenna element that do not overlap each other when viewed from above the first surface, a second conductive layer operating as a ground plane, and a dielectric between the first and second conductive layers. A conductive pattern is located between the front surface and the second surface when the first surface faces the rear surface and is located between the rear surface and the second surface when the first surface faces the front surface. The conductive pattern overlaps a part of the second conductive layer when viewed from above the first surface.

公开(公告)号：US12183996B2

公开(公告)日：2024-12-31

申请号：US18173337

申请日：2023-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Yun ,  Soonheung Kwon ,  Hosaeng Kim ,  Hyungjoo Lee

IPC: H01Q9/04 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a first conductive patch, a second conductive patch, a third conductive patch, and a wireless communication circuit. The first conductive patch includes a first edge facing the second conductive patch, a second edge perpendicularly meeting the first edge at a first corner, a third edge parallel to the first edge, and a fourth edge that is parallel to the second edge and perpendicularly meets the third edge at a second corner. The second conductive patch and the third conductive patch each have a shape identical to that of the first conductive patch. The wireless communication circuit feed power to a first point of the first edge, a second point of a fifth edge of the second conductive patch, and a third point of a sixth edge of the third conductive patch.